Method of cleaning a CVD device
A CVD vacuum vessel including an electrically conductive partition plate which divides the interior of the vacuum vessel into a plasma generating space and a film-deposition processing space, and an electrically conductive spiral shield. The electrically conductive partition plate has a plurality of through-holes connecting the plasma generating space to the film-deposition processing space and a heater for heating the electrically conductive partition plate. The partitioning plate is mounted to the vacuum vessel by means of a mounting screw such that electrical contact between the partitioning plate and the vacuum vessel is achieved through said spiral shield.
1. A cleaning method executed in a vacuum vessel which has a partition plate which divides an interior space of the vacuum vessel into a first space and a second space in which a substrate to be processed is arranged and has a plurality of through-holes for communicating between the first space and the second space, the method comprising:
feeding one or more types of fluoride gas and any of He, Ne, Ar, Kr, and Xe as cleaning gas into the first space;
a plasma generating step of generating active species by applying high-frequency electric power to electrodes arranged in the first space; and
feeding the active species generated in the plasma generating step from the first space into the second space through the plurality of through-holes,
wherein a peripheral portion of the partition plate is fixed to an inner wall of the vacuum vessel via an electrically conductive member which has spring properties, and the partition plate is kept at a ground potential.
2. The method according to claim 1 , further comprising maintaining the partition plate at a ground potential in the plasma generating step.
3. The method of claim 1 , further comprising a step of heating the partition plate using a heater incorporated in the partition plate.
4. The method of claim 1 , wherein the fluoride gases are selected from the group consisting of NF 3 , F 2 , SF 6 , CF 4 , C 2 F 6 and C 3 F 8 .
5. The method of claim 3 , wherein the heating of the partition plate is carried out within a temperature range which inhibits the adsorption of fluorine onto an inner circumferential face of the through-holes and the surface of the partition plate.
6. The method of claim 5 , wherein the cleaning gas is carbon fluoride gas or nitrogen fluoride and the partition plate is heated to 200° C. or more.
7. The method of claim 5 , wherein the cleaning gas is sulfur fluoride gas and the partition plate is heated to 100° C. or more.
8. The method according to claim 1 , wherein the vacuum vessel is configured in a CVD apparatus, wherein, when feeding the active species, the second space in which a film-deposition processing is executed is cleaned by feeding the activate species generated in the plasma generating step.
9. The method according to claim 1 , wherein a first surface of the partition plate facing the first space and a second surface of the partition plate facing the second space are in contact with electrically conductive members.
10. A cleaning method executed in a vacuum vessel which has a partition plate which divides an interior space of the vacuum vessel into a first space and a second space in which a substrate to be processed is arranged and has a plurality of through-holes for communicating between the first space and the second space, the method comprising:
feeding one or more types of fluoride gas and oxygen gas as cleaning gas into the first space;
a plasma generating step of generating active species by applying high-frequency electric power to electrodes arranged in the first space; and
feeding the active species generated in the plasma generating step from the first space into the second space through the plurality of through-holes,
wherein a peripheral portion of the partition plate is fixed to an inner wall of the vacuum vessel via an electrically conductive member which has spring properties, and the partition plate is kept at a ground potential.
11. A cleaning method executed in a vacuum vessel which has a partition plate which divides an interior space of the vacuum vessel into a first space and a second space in which a substrate to be processed is arranged and has a plurality of through-holes for communicating between the first space and the second space, the method comprising:
feeding fluoride gas as cleaning gas into the first space;
a plasma generating step of generating active species by applying high-frequency electric power to electrodes arranged in the first space; and
feeding the active species generated in the plasma generating step from the first space into the second space through the plurality of through-holes,
wherein a peripheral portion of the partition plate is fixed to an inner wall of the vacuum vessel via an electrically conductive member which has spring properties, and the partition plate is kept at a ground potential.