IP Library › Granted Patent US 8,110,063
Granted Patent B2
US 8,110,063 · App. 12/591,893 · Granted Feb 7, 2012

Mask, method of manufacturing mask, device for manufacturing mask, method of manufacturing layer of luminescent material, electro-optical device, and electronic device

Assignee: Seiko Epson Corporation
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Quick Facts
Patent No.
US 8,110,063
App. No.
12/591,893
Granted
Feb 7, 2012
Kind
B2
Abstract

This mask includes: a substrate in which an aperture is formed; a mask member which, along with being formed with a plurality of through holes, is joined to the substrate in correspondence to the aperture; and spacers which hold the substrate and the mask member with a predetermined gap between them.

Claims (19)

1. A method of manufacturing a mask, comprising:

a process of preparing a substrate which is formed with an aperture, and a mask member in which a plurality of through holes are formed in an opaque element;

a process of applying a photo-curing adhesive to said substrate or to said mask member;

a process of joining said mask member to said substrate in correspondence to said aperture;

a process of squeezing out said photo-curing adhesive which is adhered to said substrate and said mask member from the junction region between said substrate and said mask member;

a preliminary curing process of curing a portion of said photo-curing adhesive by illuminating it with light from the side of said mask member; and

a main curing process of curing said photo-curing adhesive by illuminating it with light from the side of said substrate, at least via said aperture.

2. A method of manufacturing a mask according to claim 1 , wherein said substrate is made from an optically transparent material.

3. A method of manufacturing a mask according to claim 1 , wherein said photo-curing adhesive is caused to leak out from the junction region between said substrate and said mask member, only at the outer peripheral side of said mask member.

4. A method of manufacturing a mask according to claim 1 , comprising a process of, after having adhered together said substrate and said mask member, applying said photo-curing adhesive to the outer peripheral side of said mask member.

5. A method of manufacturing a mask, comprising:

a process of preparing a substrate which is formed with an aperture, and a mask member in which a plurality of through holes are formed in an opaque element;

a process of mixing spacers into a photo-curing adhesive which joins together said substrate and said mask member;

a process of applying said photo-curing adhesive to said substrate or to said mask member;

a process of joining said mask member to said substrate in correspondence to said aperture;

a process of squeezing out said photo-curing adhesive which is adhered to said substrate and said mask member from the junction region between said substrate and said mask member;

a preliminary curing process of curing a portion of said photo-curing adhesive by illuminating it with light from the side of said mask member; and

a main curing process of curing said photo-curing adhesive by illuminating it with light from the side of said substrate, at least via said aperture.

6. A method of manufacturing a mask according to claim 5 , wherein, in at least said preliminary curing process and said main curing process, the temperature of the junction between said mask member and said substrate is managed.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 30, 2013
From: SEIKO EPSON CORPORATION
To: INTELLECTUAL KEYSTONE TECHNOLOGY LLC
Reel/Frame 030321/0510 →
Priority Claims (4)
JP 2003-061355 · Mar 7, 2003 · national
JP 2003-061356 · Mar 7, 2003 · national
JP 2003-061357 · Mar 7, 2003 · national
JP 2004-036621 · Feb 13, 2004 · national
Continuity (2)
Division 10782947 · Feb 23, 2004
Related Publication 20100084088A1 · Apr 8, 2010