Interconnection system on a plane adjacent to a solid-state device structure
An interconnection system is provided for a solid-state device. The solid-state that includes, a first layer, multiple devices and a first face. A second layer is bonded to the first face at a bonded face of the second layer that faces the first face. Electrically conductive bonds are between the first and second faces. Conductive paths are on the bonded face of the second layer and connect two or more of the conductive bonds.
1. An interconnection system for a MEMS device, comprising:
a MEMS device with contact points, including,
a silicon substrate with a face surface that has a pattern of recesses which define functional elements of the MEMS device leaving sharp-edged, highly doped ridges; and
a cover with a mating surface coupled to the face surface, the cover including patterns of metal films that engage the ridges to form connections from the face surface to the patterns of metal film on the mating surface,
wherein the MEMS device is an accelerometer and includes one or more seismic masses configured to pivot around pivot axes defined by pivot points between the seismic masses and a body of the silicon substrate.
2. The system of claim 1 , wherein the ridges have a doping of at least 10 19 boron atoms/cm 3 .
3. The system of claim 1 , wherein the mating surface is contoured.
4. The system of claim 1 , wherein the metal films are made of a material selected from at least one of aluminum, tin, copper, gold and silver.
5. The system of claim 1 , wherein the seismic masses are formed in the silicon substrate.
6. The system of claim 1 , wherein strain gauges are formed at the pivot points selectively doping the substrate to create piezoresistors that change resistance when the seismic masses pivot under acceleration.
7. The system of claim 1 , wherein the sharp edge has a radius of curvature at the edge that is no greater than 0.1 microns.
8. The system of claim 7 , wherein the mating surface is contoured in a range of 1 to 3 microns.