Low temperature co-fired ceramic (LTCC) transmit/receive (T/R) assembly utilizing ball grid array (BGA) technology

1. A system for the integration of microwave components in a low temperature co-fired ceramic, the system comprising:

a low temperature co-fired ceramic body having a top surface, into which is disposed a plurality of cavities;

a plurality of microwave devices, each said device being disposed within a cavity from said plurality of cavities such that said cavities provide radio isolation to said devices; and

a coaxial connection disposed within said body configured to connect said devices to external components said coaxial components comprising vias disposed within said co-fired ceramic body, said coaxial connection comprising a male coaxial coupler, extending from a first surface of said body, and a plurality of conductive vias disposed within said device forming a substantially coaxial configuration.

2. The system of claim 1 further comprising a bump bond array disposed on a side of said body opposed to a side of said body upon which said coaxial connection is disposed.

3. The system according to claim 1 wherein said cavities are formed prior to the firing of said body.

4. The system according to claim 1 further comprising at least one via disposed within said body connecting a first cavity within said plurality of cavities, and a second cavity in said plurality of cavities.

5. The system according to claim 1 wherein said microwave device is disposed completely within said cavity.

6. The system according to claim 1 wherein said vias are configured to maintain their coaxial configuration while making a right angle bend so as to be disposed parallel with said first surface.

7. The system according to claim 1 wherein at least one said device is a monolithic integrated microwave circuit.

8. The system according to claim 1 wherein said body comprises 12 layers of Low-temperature co-fired ceramic.

9. A passive integrated circuit for integration with at least one active circuit; said passive integrated circuit medium comprising:

a plurality of layers of low temperature co-fired ceramic;

a plurality of recesses disposed within said co-fired ceramic and configured to receive said at least one active circuit and isolate said active circuit from radio frequency interference;

conductive connections disposed between recesses of said plurality of recesses, whereby said active circuits are integrated

a coaxial connection comprising a plurality of vias disposed perpendicularly through several layers of said plurality of layers of low temperature co-fired ceramic and in an annular pattern around a ventral via; a layer of conductive material within a layer of said low temperature co-fired ceramic said layer of conductive material having a partially annular end with an interruption, said annular end being disposed around said central via and coupled both to said plurality of vias and first and second extended connectors coupled to opposing sides of said interruption; and a center via contact extending from said center via and between said first and second extended connectors.

10. The passive integrated circuit according to claim 9 , wherein said active circuit comprises a microwave device.

11. The passive integrated circuit according to claim 10 wherein said microwave device is a monolithic integrated microwave device.