Photosensitive-resin remover composition and method of fabricating semiconductor device using the same
View Patent ↗A photosensitive-resin remover composition includes an amine compound and de-ionized water, an amount of the de-ionized water being about 45% to about 99% by weight based on a total weight of the composition.
1. A photosensitive-resin remover composition, consisting essentially of:
an amine compound selected from hydrazine hydrate, methyl amine and diethyl amine;
a removing accelerator in an amount of about 0.01% to about 10% by weight based on a total weight of the composition, wherein the removing accelerator is selected from methyl gallate, 1,2,3-benzenetriol and 1,3,5-benzenetriol; and
de-ionized water, an amount of the de-ionized water being about 45% to about 99% by weight based on a total weight of the composition,
wherein the photosensitive-resin remover composition has a viscosity of about 1 to about 2 centipoise.
2. The photosensitive-resin remover composition consisting essentially of:
an amine compound selected from hydrazine hydrate, methyl amine and diethyl amine;
a removing accelerator in an amount of about 0.01% to about 10% by weight based on a total weight of the composition, wherein the removing accelerator is selected from methyl gallate, 1,2,3-benzenetriol and 1,3,5-benzenetriol;
de-ionized water, an amount of the de-ionized water being about 45% to about 99% by weight based on a total weight of the composition,
a corrosion inhibitor, the corrosion inhibitor including at least one of an aromatic mercapto compound, a triazole compound, an ammonium salt, and/or a polysaccharide,
wherein the photosensitive-resin remover composition has a viscosity of about 1 to about 2 centipoises.
3. A photosensitive-resin remover composition, consisting essentially of:
hydrazine hydrate in an amount of about 1% to about 3% by weight;
a removing accelerator in an amount of about 1% to about 3% by weight, based on a total weight of the composition, wherein the removing accelerator is selected from methyl gallate, 1,2,3-benzenetriol and 1,3,5-benzenetriol;
butyl diglycol in an amount of about 10% to about 40% by weight; and
de-ionized water in an amount of about 70% to about 88% by weight,
wherein the photosensitive-resin remover composition has a viscosity of about 1 to about 2 centipoises.