IP Library › Granted Patent US 8,138,494
Granted Patent B2
US 8,138,494 · App. 12/694,600 · Granted Mar 20, 2012

GaN series light-emitting diode structure

Assignee: Chang Gung University
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Quick Facts
Patent No.
US 8,138,494
App. No.
12/694,600
Granted
Mar 20, 2012
Kind
B2
Abstract

The present invention relates to a GaN series light-emitting diode structure, which includes a substrate; at least one GaN series layer formed over the substrate; subsequently an interface blocking structure composed of an n-type GaN series superlattice structure and a GaN series light-emitting layer, and a GaN series light-emitting layer are formed over the GaN series layer; and a p-type GaN series layer formed over the GaN series light-emitting layer. In the present invention, the radiative recombination efficiency is improved by introducing an interface blocking structure before the light-emitting layer under the epitaxial conditions of low temperature and pure nitrogen atmosphere.

Claims (27)

1. A GaN series LED structure, including:

a substrate;

at least one GaN series layer, wherein the GaN series layer is formed over said substrate;

a light-emitting layer, wherein the light-emitting layer is formed over said GaN series layer;

a p-type GaN series layer, wherein the p-type GaN series layer is formed over said light-emitting layer; and

at least one interface blocking layer, wherein the interface blocking layer is formed between said GaN series layer and said light-emitting layer.

2. The GaN series LED structure as claimed in claim 1 , wherein the interface blocking layer is composed of an n-type GaN series superlattice structure stacked with an n-type GaN layer.

3. The GaN series LED structure as claimed in claim 2 , wherein a thickness of the n-type GaN layer combined in the interface blocking layer is less than 1400 Å.

4. The GaN series LED structure as claimed in claim 3 , wherein a range of the thickness of the n-type GaN layer is between 300 Ř1400 Å.

5. The GaN series LED structure as claimed in claim 2 , wherein the n-type GaN series superlattice structure combined in the interface blocking layer is composed of a aluminum indium gallium nitride layer mutually stacked with a GaN layer.

6. The GaN series LED structure as claimed in claim 5 , wherein a range of the thickness of the n-type GaN series superlattice structure is between 600 Ř800 Å.

7. The GaN series LED structure as claimed in claim 5 , wherein a composition proportion of aluminum in the aluminum indium gallium nitride layer of the n-type GaN series superlattice structure is between 5%˜10%.

8. The GaN series LED structure as claimed in claim 2 , wherein the n-type GaN series superlattice structure further includes an InGaN layer subsequently and mutually stacked with the GaN layer.

9. The GaN series LED structure as claimed in claim 8 , wherein a composition proportion of indium in the InGaN layer is less than 10%, and a thickness of the InGaN layer is no more than 15 Å.

10. The GaN series LED structure as claimed in claim 1 , wherein an epitaxy growth temperature of the interface blocking layer ranges from 835° C. to 950° C.

11. A GaN series LED structure, including:

a substrate;

a GaN series buffer layer, wherein the GaN series buffer layer is formed over said substrate;

a first n-type GaN series superlattice structure layer, wherein the first n-type GaN series superlattice structure layer is formed over the GaN series buffer layer;

a first n-type GaN series layer, wherein the first n-type GaN series layer is formed over said first n-type GaN series superlattice structure layer;

a second n-type GaN series superlattice structure layer, wherein the second n-type GaN series superlattice structure layer is formed over said first n-type GaN series layer;

a third n-type GaN series layer, wherein the third n-type GaN series layer is formed over said second n-type GaN series superlattice structure layer;

a light-emitting layer, wherein the light-emitting layer is formed over said third n-type GaN series layer; and

a p-type GaN series layer, wherein the p-type GaN series layer is formed over said light-emitting layer.

12. The GaN series LED structure as claimed in claim 11 , wherein an interface blocking layer is composed of said second n-type GaN series superlattice structure stacked with said third n-type GaN layer.

13. The GaN series LED structure as claimed in claim 11 , wherein the p-type GaN series layer is composed of a p-type cladding layer and a p-type ohmic contact layer.

14. The GaN series LED structure as claimed in claim 13 , wherein the p-type cladding layer is a superlattice structure composed of a p-type GaN series layer.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 27, 2010
From: LIN, RAY-MING; JIANG, JHONG-HAO; FANG, BOR-REN
To: CHANG GUNG UNIVERSITY
Reel/Frame 023857/0524 →
Continuity (1)
Related Publication 20110180778A1 · Jul 28, 2011