IP Library Granted Patent US 8,146,239
Granted Patent B2
US 8,146,239 · App. 12/825,789 · Granted Apr 3, 2012

Method of forming microcoil with conducting trace and attaching trace

Assignee: Medtronic, Inc.
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Quick Facts
Patent No.
US 8,146,239
App. No.
12/825,789
Granted
Apr 3, 2012
Kind
B2
Abstract

A method for forming a microcoil includes attaching a conducting trace of conductive material to a film of insulating material and affixing an attaching trace of conductive material to the film, wherein the attaching trace is electrically isolated from the conducting trace of conductive material. The method also includes operably coupling the attaching trace to a mandrel prior to rolling of the mandrel and rolling the mandrel with the attaching trace attached thereto to circumferentially wrap the conducting trace of conductive material more than one revolution around a longitudinal axis of rolling. The attaching trace remains electrically isolated from the conducting trace after rolling the mandrel.

Claims (37)

1. A method for forming a microcoil comprising:

attaching a conducting trace of conductive material to a film of insulating material;

affixing an attaching trace of conductive material to the film, wherein the attaching trace is electrically isolated from the conducting trace of conductive material;

operably coupling the attaching trace to a mandrel prior to rolling of the mandrel; and

rolling the mandrel with the attaching trace attached thereto to circumferentially wrap the conducting trace of conductive material more than one revolution around a longitudinal axis of rolling, the attaching trace remaining electrically isolated from the conducting trace after rolling the mandrel.

2. The method for forming a micro coil of claim 1 wherein said attaching the conducting trace of conductive material comprises adhering a sheet of conductive material to the film of insulating material, masking the sheet of conductive material with a masking material, etching the sheet of conductive material, and removing the masking material.

3. The method for forming a microcoil of claim 1 wherein the conducting trace of conductive material includes copper.

4. The method for forming a microcoil of claim 1 wherein the film of insulating material includes polyimide.

5. The method for forming a microcoil of claim 1 wherein the mandrel comprises a round cross section.

6. The method for forming a microcoil of claim 1 wherein the mandrel is hollow.

7. The method for forming a microcoil of claim 1 wherein the mandrel comprises a semi-rigid coaxial conductor.

8. The method for forming a microcoil of claim 1 , wherein operably coupling the attaching trace to the mandrel includes soldering the attaching trace to the mandrel.

9. The method for forming a microcoil of claim 1 , wherein an entirety of the conducting trace lies substantially within a plane before rolling the mandrel.

10. The method for forming a microcoil of claim 1 , wherein rolling the mandrel extends the conducting trace progressively radially outward from the longitudinal axis.

11. A method for forming a microcoil comprising:

attaching a conducting trace of conductive material to a substantially planar film of flexible insulating material;

affixing an attaching trace of conductive material to the film, wherein the attaching trace is electrically isolated from the conducting trace of conductive material;

operably coupling the attaching trace to a mandrel prior to rolling of the mandrel; and

rolling the mandrel with the attaching trace attached thereto such that, when rolled, an end of the film is pulled, and the conducting trace of conductive material circumferentially wraps around a longitudinal axis of rolling, the attaching trace remaining electrically isolated from the conducting trace after rolling the mandrel.

12. The method for forming a microcoil of claim 11 , wherein said attaching the conducting trace of conductive material further comprises adhering a sheet of conductive material to the substantially planar film of flexible insulating material, masking the sheet of conductive material with a masking material, etching the sheet of conductive material, and removing the masking material.

13. The method for forming a microcoil of claim 11 wherein the conducting trace of conductive material includes copper.

14. The method for forming a microcoil of claim 11 wherein the substantially planar film of flexible insulating material includes polyimide.

15. The method for forming a microcoil of claim 11 wherein the mandrel comprises a round cross section.

16. The method for forming a microcoil of claim 11 wherein the mandrel is hollow.

17. The method for forming a microcoil of claim 11 wherein the mandrel comprises a semi-rigid coaxial conductor.

18. The method for forming a microcoil of claim 11 , wherein operably coupling the attaching trace to the mandrel includes soldering the attaching trace to the mandrel.

19. The method for forming a microcoil of claim 11 , wherein an entirety of the conducting trace lies substantially within a plane before rolling the mandrel.

20. The method for forming a microcoil of claim 11 , wherein rolling the mandrel extends the conducting trace progressively radially outward from the longitudinal axis.

21. A method for forming a microcoil comprising:

attaching a conducting trace of conductive material to a film of insulating material, the conducting trace of conductive material including a leg;

affixing an attaching trace of conductive material to the film, wherein the attaching trace is electrically isolated from the conducting trace of conductive material;

operably coupling the attaching trace to a mandrel; and

rolling the mandrel with the attaching trace attached thereto about a longitudinal axis to thereby circumferentially wrap the conducting trace of conductive material more than one revolution around the longitudinal axis and to thereby extend the leg progressively radially outward from the longitudinal axis, the attaching trace remaining electrically isolated from the conducting trace after rolling the mandrel.

22. The method of claim 21 , wherein operably coupling the attaching trace to the mandrel includes soldering the attaching trace to the mandrel.

23. The method of claim 21 , wherein the conducting trace of conductive material further includes a lead electrically coupled to the leg, and wherein rolling the mandrel includes extending the lead substantially parallel to the longitudinal axis.

24. The method of claim 21 , wherein the conducting trace of conductive material includes a first leg and a second leg that are electrically coupled together via a joining portion, and wherein rolling the mandrel includes extending each of the first and second legs progressively radially outward from the longitudinal axis and extending the joining portion substantially parallel to the longitudinal axis.

25. The method of claim 21 , further comprising operably coupling the microcoil to a distal end of a catheter.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 15, 2010
From: MILLS, GERALD W.
To: IMAGE-GUIDED NEUROLOGICS, INC.
Reel/Frame 024690/0322 →
MERGER Recorded Jul 15, 2010
From: IMAGE-GUIDED NEUROLOGICS, INC.
To: MEDTRONIC IMAGE-GUIDED NEUROLOGICS, INC.
Reel/Frame 024690/0346 →
MERGER Recorded Jul 15, 2010
From: MEDTRONIC IMAGE-GUIDED NEUROLOGICS, INC.
To: MEDTRONIC, INC.
Reel/Frame 024690/0389 →
Continuity (3)
Division 11735287 · Apr 13, 2007
Continuation 09736529 · Dec 13, 2000
Related Publication 20100263205A1 · Oct 21, 2010