Boron nitride and boron-nitride derived materials deposition method
A method and apparatus are provided to form spacer materials adjacent substrate structures. In one embodiment, a method is provided for processing a substrate including placing a substrate having a substrate structure adjacent a substrate surface in a deposition chamber, depositing a spacer layer on the substrate structure and substrate surface, and etching the spacer layer to expose the substrate structure and a portion of the substrate surface, wherein the spacer layer is disposed adjacent the substrate structure. The spacer layer may comprise a boron nitride material. The spacer layer may comprise a base spacer layer and a liner layer, and the spacer layer may be etched in a two-step etching process.
1. A method for fabricating a semiconductor mask, comprising:
providing a semiconductor stack having a sacrificial mask disposed adjacent thereto;
depositing a conformal boron nitride material layer on the sacrificial mask and semiconductor stack;
etching the boron nitride material layer to provide a spacer mask having spacer lines adjacent to the sidewalls of the sacrificial mask and to expose the top surface of the sacrificial mask;
depositing and patterning a photoresist layer above the spacer mask and the sacrificial mask to expose a portion of the spacer mask; and
etching the exposed end-portions that are continuity between pairs of spacer lines prior to removing the sacrificial mask; and
removing the sacrificial mask.
2. The method of claim 1 , wherein the boron nitride material layer further comprises carbon, silicon, chlorine, oxygen, or combinations thereof.
3. The method of claim 1 , wherein the boron nitride material layer comprises a base boron nitride material layer and a liner layer disposed on the base boron nitride material layer.
4. The method of claim 3 , wherein the etching the boron nitride material layer to provide a spacer mask comprises anisotropic etching the liner layer to expose the base boron nitride material layer and isotropic etching the exposed base boron nitride material layer.
5. The method of claim 4 , wherein the liner layer comprises silicon nitride and the sacrificial mask comprises a material selected from the group consisting of silicon nitride, silicon oxide, amorphous silicon, amorphous carbon, and combinations thereof.