Laminated electronic component
A laminate is prepared in which adjacent internal electrodes are electrically insulated from each other at an end surface at which the internal electrodes are exposed, a space between the adjacent internal electrodes, which is measured in the thickness direction of insulating layers, is about 10 μm or less, and a withdrawn distance of the adjacent internal electrodes from the end surface is about 1 μm or less. In an electroplating step, electroplating deposits deposited on the ends of the adjacent internal electrodes are grown so as to be connected to each other.
1. A laminated electronic component, comprising:
a laminate including insulating layers laminated to each other, and internal electrodes provided along interfaces between the insulating layers, ends of the internal electrodes being exposed at a predetermined surface of the laminate; and
at least one external electrode provided directly on the predetermined surface of the laminate so that the ends of the internal electrodes exposed at the predetermined surface of the laminate are electrically connected to each other by the at least one external electrode; wherein
the at least one external electrode is defined substantially by electroplated material;
at the predetermined surface of the laminate at which the internal electrodes are exposed, a space between the internal electrodes adjacent to each other, which is measured in the thickness direction of the insulating layers, is about 10 μm or less, and a withdrawn distance of the internal electrodes from the predetermined surface is about 1 μm or less; and
the ends of the internal electrodes exposed at the predetermined surface of the laminate are directly connected to one another only by the electroplated material of the at least one external electrode.
2. The laminated electronic component according to claim 1 , wherein the at least one external electrode includes plating layers, and one of the plating layers which is located closest to a surface of the laminate includes Ni as a primary component.
3. The laminated electronic component according to claim 1 , wherein the at least one external electrode includes plating layers, and one of the plating layers thereof which is located closest to a surface of the laminate includes Cu as a primary component.
4. The laminated electronic component according to claim 1 , wherein the external electrodes are provided on the same planar surface of the laminate.
5. A laminated electronic component, comprising:
a laminate including insulating layers laminated to each other, and internal electrodes provided along interfaces between the insulating layers, ends of the internal electrodes being exposed at a predetermined surface of the laminate; and
at least one external electrode provided directly on the predetermined surface of the laminate so that the ends of the internal electrodes exposed at the predetermined surface of the laminate are electrically connected to each other by the at least one external electrode; wherein
the at least one external electrode is substantially composed of electroplated material; and
at the predetermined surface of the laminate at which the internal electrodes are exposed, a space between the internal electrodes adjacent to each other, which is measured in the thickness direction of the insulating layers, is about 20 μm or less, and a protruding length of the internal electrodes from the predetermined surface is at least about 0.1 μm; and
the ends of the internal electrodes exposed at the predetermined surface of the laminate are directly connected to one another only by the electroplated material of the at least one external electrode.
6. The laminated electronic component according to claim 5 , wherein the at least one external electrode includes plating layers, and one of the plating layers which is located closest to a surface of the laminate includes Ni as a primary component.
7. The laminated electronic component according to claim 5 , wherein the at least one external electrode includes plating layers, and one of the plating layers thereof which is located closest to a surface of the laminate includes Cu as a primary component.
8. The laminated electronic component according to claim 5 , wherein the external electrodes are provided on the same planar surface of the laminate.