Method for manufacturing semiconductor device
View Patent ↗A method for manufacturing a semiconductor device includes: forming a photocatalytic layer and an organic compound layer in contact with the photocatalytic layer over a substrate having a light transmitting property; forming an element forming layer over the substrate having the light transmitting property with the photocatalytic layer and the organic compound layer in contact with the photocatalytic layer interposed therebetween; and separating the element forming layer from the substrate having the light transmitting property after the photocatalytic layer is irradiated with light through the substrate having the light transmitting property.
1. A method for manufacturing a semiconductor device, comprising:
forming a photocatalytic layer and an organic compound layer in contact with the photocatalytic layer over a first substrate having a light transmitting property;
forming an element forming layer over the first substrate with the photocatalytic layer and the organic compound layer interposed therebetween after forming the photocatalytic layer and the organic compound layer;
separating the element forming layer from the first substrate by irradiating the photocatalytic layer with light; and
attaching a second substrate having flexibility to the organic compound layer, after separating the element forming layer from the first substrate.
2. A method for manufacturing a semiconductor device, comprising:
forming an organic compound layer over a first substrate having a light transmitting property;
forming a photocatalytic layer in contact with the organic compound layer after forming the organic compound layer so that the organic compound layer is interposed between the first substrate and the photocatalytic layer;
forming an element forming layer over the photocatalytic layer after forming the photocatalytic layer; and
separating the element forming layer from the first substrate by irradiating the photocatalytic layer with light through the first substrate,
wherein a second substrate having flexibility is attached to a surface of the photocatalytic layer after the element forming layer is separated from the first substrate.
3. A method for manufacturing a semiconductor device, comprising:
forming a photocatalytic layer over a first substrate having a light transmitting property;
forming an organic compound layer having a light shielding property in contact with the photocatalytic layer after forming the photocatalytic layer;
forming an element forming layer over the organic compound layer after forming the organic compound layer;
separating the element forming layer from the first substrate by irradiating the photocatalytic layer with light; and
attaching a second substrate having flexibility to the organic compound layer, after separating the element forming layer from the first substrate.
4. The method for manufacturing a semiconductor device according to claim 1 ,
wherein separation is performed at an interface between the photocatalytic layer and the organic compound layer, so that the element forming layer is separated from the first substrate.
5. The method for manufacturing a semiconductor device according to claim 2 ,
wherein separation is performed at an interface between the photocatalytic layer and the organic compound layer, so that the element forming layer is separated from the first substrate.
6. The method for manufacturing a semiconductor device according to claim 3 ,
wherein separation is performed at an interface between the photocatalytic layer and the organic compound layer, so that the element forming layer is separated from the first substrate.
7. The method for manufacturing a semiconductor device according to claim 1 ,
wherein a wavelength of the light is a wavelength which activates the photocatalytic layer.
8. The method for manufacturing a semiconductor device according to claim 2 ,
wherein a wavelength of the light is a wavelength which activates the photocatalytic layer.
9. The method for manufacturing a semiconductor device according to claim 3 ,
wherein a wavelength of the light is a wavelength which activates the photocatalytic layer.
10. The method for manufacturing a semiconductor device according to claim 1 ,
wherein the element forming layer comprises at least one selected from the group consisting of a thin film transistor, a diode, and a resistor.
11. The method for manufacturing a semiconductor device according to claim 2 ,
wherein the element forming layer comprises at least one selected from the group consisting of a thin film transistor, a diode, and a resistor.
12. The method for manufacturing a semiconductor device according to claim 3 ,
wherein the element forming layer comprises at least one selected from the group consisting of a thin film transistor, a diode, and a resistor.
13. The method for manufacturing a semiconductor device according to claim 1 ,
wherein the element forming layer comprises at least one selected from the group consisting of a light emitting element, a liquid crystal element, and an electrophoresis element.
14. The method for manufacturing a semiconductor device according to claim 2 ,
wherein the element forming layer comprises at least one selected from the group consisting of a light emitting element, a liquid crystal element, and an electrophoresis element.
15. The method for manufacturing a semiconductor device according to claim 3 ,
wherein the element forming layer comprises at least one selected from the group consisting of a light emitting element, a liquid crystal element, and an electrophoresis element.
16. The method for manufacturing a semiconductor device according to claim 1 ,
wherein the semiconductor device functions as one of a light emitting device, a liquid crystal display device, an electrophoretic display device, a wireless chip, a solar cell, and a sensor.
17. The method for manufacturing a semiconductor device according to claim 2 ,
wherein the semiconductor device functions as one of a light emitting device, a liquid crystal display device, an electrophoretic display device, a wireless chip, a solar cell, and a sensor.
18. The method for manufacturing a semiconductor device according to claim 3 ,
wherein the semiconductor device functions as one of a light emitting device, a liquid crystal display device, an electrophoretic display device, a wireless chip, a solar cell, and a sensor.
19. The method for manufacturing a semiconductor device according to claim 1 , wherein a light absorber is dispersed in the organic compound layer.
20. The method for manufacturing a semiconductor device according to claim 3 , wherein a light absorber is dispersed in the organic compound layer.
21. The method for manufacturing a semiconductor device according to claim 19 , wherein the light absorber is a dye or an ultraviolet absorber.
22. The method for manufacturing a semiconductor device according to claim 20 , wherein the light absorber is a dye or an ultraviolet absorber.