Coating apparatus
A coating apparatus ( 100 ) for batch coating of substrates is presented. In the batch coater layers of a stack can be deposited by means of physical vapor deposition, by means of chemical vapor deposition or by a mixture of both processes. When compared to previous apparatus, the mixed mode process is particularly stable. This is achieved by using a rotatable magnetron ( 112 ) rather than the prior-art planar magnetrons. The apparatus is further equipped with a rotatable shutter that allows for concurrent or alternating process steps.
1. A coating apparatus for coating substrates comprising:
an evacuable chamber and, means for establishing a physical vapour deposition process and, means for establishing a chemical vapour deposition process wherein said means can be operated alternatively or concurrently inside said chamber
wherein said physical vapour deposition means comprises one or more rotatable sputtering magnetrons for enabling a stable process of combined physical and chemical vapour deposition on said substrates
wherein a sputtering zone of at least one of the rotatable sputtering magnetrons is coverable by a tubular shutter that is rotatably moveable around said rotatable sputtering magnetron, and
wherein said tubular shutter is eccentrically mounted to said rotatable sputtering magnetron.
2. The coating apparatus of claim 1 , wherein said rotatable sputtering magnetron is enclosed in a housing mountable to a wall of said evacuable chamber, said housing having an opening for sputtering from said rotatable sputtering magnetron into said chamber through said opening.
3. The coating apparatus of claim 2 , wherein said housing is pivotably attached to said chamber.
4. The coating apparatus of claim 2 , wherein said housing further includes an end fixture configured to rotate, cool, and energize said sputtering magnetron, said end fixture being axially mountable to said sputtering magnetron at the outside of said housing.
5. The coating apparatus according to claim 2 , wherein said housing further includes an end fixture configured to rotate said shutter, said end fixture being mountable to said sputtering magnetron at the outside of said housing.
6. The coating apparatus according to claim 1 , wherein said shutter is made of a conductive material and is electrically biassable with respect to said magnetron.
7. The coating apparatus according to claim 1 , wherein said magnetron and said shutter are separated by a gap at said sputtering zone, said gap being wide enough to ignite a plasma between said magnetron and said shutter.
8. The coating apparatus according to claim 1 , wherein said shutter is assemblable out of comprises one or more pieces.
9. The coating apparatus according to claim 1 , wherein a gas feed is present between said magnetron and said shutter.
10. The coating apparatus according to claim 9 , wherein said shutter is configured to close an opening between said rotatable sputtering magnetron and said chamber to maintain a gas atmosphere between said magnetron and said shutter when said shutter covers said sputtering zone, said gas atmosphere being different than a gas atmosphere in said chamber.
11. The coating apparatus according to claim 1 , wherein said rotatable sputtering magnetron is of the balanced type.
12. The coating apparatus according to claim 1 , wherein said rotatable sputtering magnetron is of the unbalanced type.
13. A coating apparatus for coating a substrate comprising:
an evacuable chamber,
a magnetron apparatus configured to establish a physical vapour deposition process, and
a chemical vapour deposition apparatus configured to establish a chemical vapour deposition process,
wherein said magnetron and said chemical vapour deposition apparatus are configured to operate alternatively or concurrently inside said chamber,
wherein said magnetron apparatus comprises one or more rotatable sputtering magnetrons configured to enable a stable process of combined physical and chemical vapour deposition on a substrate,
wherein a sputtering zone of at least one rotatable sputtering magnetron is coverable by a tubular shutter that is rotatably moveable around said rotatable sputtering magnetron, and
wherein said tubular shutter is eccentrically mounted to said rotatable sputtering magnetron.
14. The coating apparatus of claim 13 , wherein said rotatable sputtering magnetron is enclosed in a housing mountable to a wall of said evacuable chamber, said housing having an opening for sputtering from said rotatable sputtering magnetron into said chamber through said opening.
15. The coating apparatus of claim 14 , wherein said housing is pivotably attached to said chamber.
16. The coating apparatus of claim 14 , wherein said housing further includes an end fixture configured to rotate, cool, and energize said sputtering magnetron, said end fixture being axially mountable to said sputtering magnetron at the outside of said housing.
17. The coating apparatus according to claim 14 , wherein said housing further includes an end fixture configured to rotate said shutter, said end fixture being mountable to said sputtering magnetron at the outside of said housing.
18. The coating apparatus according to claim 13 , wherein said shutter is made of a conductive material and is electrically biassable with respect to said magnetron.
19. The coating apparatus according to claim 13 , wherein said magnetron and said shutter are separated by a gap at said sputtering zone, said gap being wide enough to ignite a plasma between said magnetron and said shutter.