Head-stack assembly including heat-dissipation and impedance-matching structure and hard-disk drive using the head-stack assembly

1. A head-stack assembly, comprising:

a magnetic-recording head;

a lead-suspension supporting said magnetic-recording head on an actuator arm;

a metal plate coupled with said actuator arm,

a resin layer disposed on said metal plate;

a flexible-printed-circuit board being disposed on said resin layer, and substantially perpendicularly connected to said lead-suspension;

an arm-electronics module disposed on said flexible-printed-circuit board configured to shape a write-signal current waveform of a write signal to said magnetic-recording head;

transmission lines disposed on said flexible-printed-circuit board configured to transmit said write signal to, and a read-back signal from, said lead-suspension; and

a single intermediate conductor layer that is disposed between said resin layer and said flexible-printed-circuit board, and having a planar shape substantially facing a bottom of said arm-electronics module and a bottom of said transmission lines.

2. The head-stack assembly of claim 1 , wherein an area of said intermediate conductor layer located below said arm-electronics module is larger than an area of said bottom of said arm-electronics module.

3. The head-stack assembly of claim 2 , wherein a width of said intermediate conductor layer located below said transmission lines is at least equal a width of said transmission lines.

4. The head-stack assembly of claim 3 , wherein a connection point of said flexible-printed-circuit board to said lead-suspension is separated from said metal plate by a space; and, a distance between said connection point of said flexible-printed-circuit board to said lead-suspension and said intermediate conductor layer is longer than a length of said space.

5. The head-stack assembly of claim 4 , wherein said length of said space, and a distance between said connection point of said flexible-printed-circuit board to said lead-suspension and said metal plate are longer than a distance between said arm-electronics module and said metal plate.

6. The head-stack assembly of claim 1 , wherein said intermediate conductor layer is disposed such that said intermediate conductor layer covers all of said bottom of said transmission lines, all of said bottom of said arm-electronics module and all of a periphery of said bottom of said arm-electronics module.

7. The head-stack assembly of claim 1 , wherein said flexible-printed-circuit board comprises connection terminals of said transmission lines, and said connection terminals are connected by solder to said lead-suspension; said intermediate conductor layer is disposed such that said intermediate conductor layer covers all of said bottom of said transmission lines, all of said bottom of said arm-electronics module and all of a periphery of said bottom of said arm-electronics module; a connection point of said flexible-printed-circuit board to said lead-suspension is separated from said metal plate by a space; and, a length of said space, and a distance from said connection point to said intermediate conductor layer are longer than a distance between said arm-electronics module and said metal plate.

8. The head-stack assembly of claim 1 , wherein a material of said intermediate conductor layer comprises a material selected from the group consisting of copper and rolled copper.

9. The head-stack assembly of claim 1 , wherein an output impedance of said arm-electronics module, a characteristic impedance of write-signal transmission lines on said lead-suspension, and a characteristic impedance of write-signal transmission lines on said flexible-printed-circuit board connecting said arm-electronics module to said lead-suspension are substantially equal to one another.

10. The head-stack assembly of claim 9 , wherein a distance between a conductor layer on said flexible-printed-circuit board and said intermediate conductor layer is selected to set said characteristic impedance of said write-signal transmission lines on said flexible-printed-circuit board to a value substantially equal to a value of said characteristic impedance of write-signal transmission lines on said lead-suspension.

11. The head-stack assembly of claim 1 , wherein said transmission lines comprise write-signal transmission lines and read-back-signal transmission lines; and

said head-stack assembly comprises:

a heater element disposed in said magnetic-recording head; and

heater lines disposed on said flexible-printed-circuit board configured to transmit a signal from said arm-electronics module to said heater element so as to control fly height of said magnetic-recording head; and

wherein said intermediate conductor layer has a width at least equal to a width of said write-signal transmission lines, a width of said heater lines, and a width of said read-back-signal transmission lines directly below said respective lines.

12. A head-stack assembly, comprising:

a lead-suspension supporting a magnetic-recording head on said actuator arm,

a metal plate coupled with said actuator arm,

an insulating layer disposed on said metal plate,

a flexible-printed-circuit board being disposed on said insulating layer, and substantially perpendicularly connected by solder to said lead-suspension,

an arm-electronics module disposed on said flexible-printed-circuit board configured to shape a write-signal current waveform of a write signal to a magnetic-recording head,

transmission lines disposed on said flexible-printed-circuit board configured to transmit said write signal to, and a read-back signal from, said lead-suspension, and

a single intermediate conductor layer formed between said insulating layer and said flexible-printed-circuit board, and having a planar shape substantially facing a bottom of said arm-electronics module and a bottom of said transmission lines,

wherein a connection point of said solder connection to said lead-suspension is separated from said metal plate by a space.

13. The head-stack assembly of claim 12 , wherein said transmission lines comprise write-signal transmission lines and read-back-signal transmission lines; and a width of said intermediate conductor layer located below said write-signal transmission lines is at least equal to a width of said write-signal transmission lines.

14. The head-stack assembly of claim 12 ; wherein said transmission lines comprise write-signal transmission lines and read-back-signal transmission lines; and a width of said intermediate conductor layer located below said write-signal transmission lines is at least equal to a width of said write-signal transmission lines, and a width of said intermediate conductor layer located below said read-back-signal transmission lines is at least equal to a width of said read-back-signal transmission lines.

15. The head-stack assembly of claim 12 , wherein a length of said space is larger than a distance between said arm-electronics module and said metal plate.

16. The hard-disk drive of claim 12 , wherein a plurality of periodical holes are provided in said intermediate conductor layer; said plurality of holes in said intermediate conductor layer are periodically arranged in a sequential array from a starting point to an end point of said transmission lines directly below said transmission lines in a same direction as a longitudinal direction of said transmission lines; and a hole of said plurality of holes has a width larger than a width of said transmission lines.

17. A hard-disk drive, comprising:

a head-stack assembly configured to support a magnetic-recording head, and configured to transmit a write signal and read-back signal between a signal-processing unit disposed outside a disk enclosure of said hard-disk drive and said magnetic-recording head, said head-stack assembly comprising:

a lead-suspension supporting said magnetic-recording head on said actuator arm,

a metal plate coupled with said actuator arm,

a resin layer disposed on said metal plate,

a flexible-printed-circuit board being disposed on said resin layer, and substantially perpendicularly connected to said lead-suspension,

an arm-electronics module disposed on said flexible-printed-circuit board configured to shape a write-signal current waveform of a write signal to said magnetic-recording head,

transmission lines disposed on said flexible-printed-circuit board configured to transmit said write signal to, and said read-back signal from, said lead-suspension,

a coil configured to rotate said actuator arm to perform positioning of said magnetic-recording head, and

a single intermediate conductor layer formed between said resin layer and said flexible-printed-circuit board, and having a planar shape substantially facing a bottom of said arm-electronics module and a bottom of said transmission lines.

18. The hard-disk drive of claim 17 , wherein an output impedance of said arm-electronics module, a characteristic impedance of write-signal transmission lines on said lead-suspension, and a characteristic impedance of write-signal transmission lines on said flexible-printed-circuit board connecting said arm-electronics module to said lead-suspension are substantially equal to one another.

19. The hard-disk drive of claim 18 , wherein a distance between a conductor layer on said flexible-printed-circuit board and said intermediate conductor layer is selected to set said characteristic impedance of said write-signal transmission lines on said flexible-printed-circuit board to a value substantially equal to a value of said characteristic impedance of write-signal transmission lines on said lead-suspension.

20. The hard-disk drive of claim 17 , further comprising:

a plurality of lead-suspensions disposed on said flexible-printed-circuit board to shape a plurality of write signals to, and a plurality of read-back signals from, a plurality of respective magnetic-recording heads;

a plurality of transmission lines electrically connected to said plurality of respective lead-suspensions that are disposed on said flexible-printed-circuit board; and

said single intermediate conductor layer disposed between said resin layer and said flexible-printed-circuit board, and having a planar shape substantially facing a bottom of said arm-electronics module and a bottom of said plurality of transmission lines.