Impedance matched circuit board
An impedance matched circuit board utilizes a series of vias, one signal via that is surrounded by four ground vias in order to effect impedance matching with a coaxial signal transmission line. The vias are plated and extend through the thickness of the circuit board. Both opposing surfaces of the circuit board are provided with a conductive ground layer and each such ground layer has an opening formed there that encompasses one or more of the vias. On the top surface the opening surrounds the signal and ground via and on the bottom surface the opening only partially surrounds the signal via and the opening includes a convex portion formed therein.
1. A circuit board having opposite faces comprising:
conductive signal via extending through the thickness of the circuit board, to which a central conductor of a high-frequency coaxial connector is connected;
a plurality of conductive ground vias for reference electric potential extending through said circuit board thickness and arranged around a periphery of the signal, via for permitting a terminal for shield of the high-frequency coaxial connector to be connected thereto;
a first ground layer formed by a conductor film disposed on one of the circuit board faces;
a thin signal line, which is connected to said signal via and is as a microstrip line on the circuit board face; and,
a second ground layer formed by a conductor film disposed on the other of said circuit board faces;
wherein:
the first ground layer has a first opening turned therein in which the conductive film is removed so as to define a first opening that encircles said via signal; and
the second ground layer has a second opening formed in which the conductive film is removed so as to define a second opening that encircles the periphery of said signal via, the second opening including a convex portion configured to protrude toward said signal via at a region corresponding to the thin signal line in said second relief part opening.
2. The circuit board according to claim 1 , wherein the convex portion has a width not less than seven times as large as a width of the thin signal line.
3. The circuit board according to claim 1 , wherein a distance that a front end of the convex portion is spaced away from said signal via is determined depending on a withstanding voltage for insulation.
4. The circuit board according to claim 1 , wherein the first ground layer includes a first opening, from which said conductive film is removed so as to have a width not less than three times as large as a width of said thin signal line on both sides of the signal thin line, respectively.
5. The circuit board according to claim 1 , wherein
the first opening contains therein said signal via and all of said ground vias are connected to the first opening; and
the second opening contains therein the signal via without containing therein any of the ground vias.
6. An impedance matched circuit board for providing a connection with a high-frequency signal transmission line, the circuit board comprising:
a substrate, the substrate having opposite first and second surfaces, the first and second surfaces supporting respective first and second ground reference layers disposed thereon;
a signal via extending completely through said substrate, the interior surface of the signal via being coated with a conductive material for connection thereto by a high-frequency signal transmission line, a plurality of ground vias extending completely through said substrate, the ground terminals being spaced from said signal via and from each other such that they are arranged around a periphery of said signal via, the interior surfaces of the ground vias being coated with a conductive material for connection thereto by a ground line for connection thereto by a shield of the high-frequency coaxial connector to be connected thereto;
the first ground reference layer including a first opening defined therein which encircles said signal via on said substrate first surface, the first opening including a slot portion that extends away from said signal via; and said circuit board further including a conductive signal line extending away from said signal via and through said first opening and the first opening slot portion; and,
the second ground reference layer including a second opening defined therein which also encircles said signal via on said substrate second surface, the second opening further including a convex portion into which a portion of said second ground reference layer extends toward said signal via in alignment with and in opposition to the conductive signal line on said first surface.
7. The circuit board according to claim 6 , wherein the second opening convex portion has an arcuate configuration.
8. The circuit board according to claim 6 , wherein said second opening convex portion has a linear configuration.
9. The circuit board according to claim 6 , wherein said conductive signal line has a preselected width, W, and said second opening convex portion has a width which is not less than seven times the width W of said conductive signal line.
10. The circuit board according to claim 6 , wherein said conductive signal line has a predetermined width W and said first opening slot-like portion has a width equal to 7 W, and said conductive signal line is aligned within said first opening slot-like portion such that said first opening slot-like portion has a width of 3 W on opposite sides of said conductive signal line.
11. The circuit board according to claim 6 , wherein a front end of said second opening convex portion is spaced away from said signal via a distance determined depending on a withstanding voltage for insulation.
12. The circuit board according to claim 6 , wherein said second opening convex portion projects inwardly of said second opening approximately one half of a radius of said second opening.
13. The circuit board according to claim 6 , wherein said ground vias are positioned around said second opening at corners of an imaginary four-sided figure.
14. The circuit board according to claim 6 , wherein said second opening convex portion extends toward said signal via within the boundaries of an angle, alpha, that is formed by drawing imaginary lines through two of said ground vias and a center of said signal via.
15. The circuit board according to claim 14 , wherein the angle alpha is 90 degrees.
16. The circuit board according to claim 6 , wherein said first opening encircles said signal via and said ground vias, and said second opening encircles only said signal via.
17. The circuit board according to claim 16 , wherein an inner edge of said first opening is spaced away said ground vias.
18. The circuit board according to claim 16 , wherein the inner edge of said first second opening contacts said ground vias.