Laser diode package with enhanced cooling
View Patent ↗A laser diode package assembly includes a reservoir filled with a fusible metal in close proximity to a laser diode. The fusible metal absorbs heat from the laser diode and undergoes a phase change from solid to liquid during the operation of the laser. The metal absorbs heat during the phase transition. Once the laser diode is turned off, the liquid metal cools off and resolidifies. The reservoir is designed such that that the liquid metal does not leave the reservoir even when in liquid state. The laser diode assembly further includes a lid with one or more fin structures that extend into the reservoir and are in contact with the metal in the reservoir.
1. A laser diode device comprising:
a substrate having an upper surface and a lower surface;
a plurality of v-grooves formed in the upper surface;
a plurality of laser diode bar assemblies, wherein a single laser diode bar assembly from the plurality of laser diode bar assemblies is placed within each v-groove of the plurality of v-grooves, wherein each laser diode bar assembly comprises:
a thermal plate having a height and a width;
a cavity disposed within an upper region of the thermal plate, the cavity having a first predetermined height and a first predetermined width and being at least partially filled with a fusible material; wherein the first predetermined width of the cavity is less than the width of the thermal plate and the first predetermined height of the cavity is less than the height of the thermal plate;
a cover plate disposed on the thermal plate; and
a laser diode coupled to the cover plate.
2. The laser diode device of claim 1 wherein the first predetermined height of the cavity is in the range of about 25 μm to about 75 μm.
3. The laser diode device of claim 1 wherein the thermal plate comprises Copper and Tungsten.
4. The laser diode device of claim 1 wherein the fusible material comprises a Copper plate embedded with Gallium.
5. The laser diode device of claim 1 wherein the fusible material comprises solid paraffin.
6. The laser diode device of claim 1 wherein the fusible material is characterized by a first solid portion and a second non-solid portion.