Photosensitive thermosetting resin composition and flexible printed circuit board

1. A photosensitive thermosetting resin composition of an alkali development type, comprising:

(A) a resin component having a (meth)acryloyl group and a carboxyl group in one molecule and soluble in a dilute alkali solution;

(B) a phosphorus-containing epoxy thermosetting component;

(C) a photopolymerization initiator;

(D) a cyano phenoxy phosphazene compound or a cyanate phenoxy phosphazene compound as an organophosphorus compound other than said (B) component; and

(E) a diluent.

2. The photosensitive thermosetting resin composition according to claim 1 , further comprising (F) a phosphorus-containing photopolymerizable monomer component other than said (B), (D), and (E) components.

3. The photosensitive thermosetting resin composition according to claim 2 , wherein (F) said phosphorus-containing photopolymerizable monomer contains a phosphorus-containing (meth)acryloyl compound which is derived by a reaction between a polyfunctional (meth)acryl compound having three or more (meth)acryloyl groups in a molecule and at least one kind among said phosphorus compounds represented by the formulas (1), (2), and (3), with an equivalent weight of the organophosphorus compound being 0.1 to 0.7 per one equivalent weight of the (meth)acryloyl group.

4. The photosensitive thermosetting resin composition according to claim 1 ,

wherein (B) said phosphorus-containing epoxy thermosetting component is a phosphorus-containing epoxy thermosetting component which is derived by a reaction between (G) a component represented by the following formula (1), (2), or (3)

(in the formulas (1) to (3), R 1 , R 2 , R 3 , R 4 , R 5 , R 6 , R 7 , R 8 are the same or different, each representing a hydrogen atom, or a monofunctional aliphatic group or aromatic group) and (H) a component made of epoxy resin having two or more epoxy groups in a molecule.

5. The photosensitive thermosetting resin composition according to claim 1 , wherein in (B) said phosphorus-containing epoxy thermosetting component, a phosphorus content ratio is 1 to 10 mass % and an weight per epoxide equivalent is 150 g/eq to 800 g/eg.

6. The photosensitive thermosetting resin composition according to claim 1 , wherein the phosphazene compound contains a phosphazene oligomer represented by the following formula (4) or (5)

(in the formulas (4) to (5), R 9 and R 10 each are a monovalent organic group not containing a hydrogen atom or halogen, and n is an integer from 3 to 10).

7. The photosensitive thermosetting resin composition according to claim 1 , wherein (D) said organophosphorus compound contains, in addition to the phosphazene compound, at least one kind selected from:

a phosphoric acid melamine compound represented by the following formula (6)

(where m is 1 to 10);

phosphinate represented by the following formula (7) or (8)

(in the formula, R 11 and R 12 are the same or different, each being an alkyl group with a carbon number of 1 to 6 or an aryl group with a carbon number of 6 to 12 which is straight- or branch-chained, M q+ is at least one ion selected from ionized Mg, Ca, Al, Sb, Sn, Ge, Ti, Zn, Fe, Zr, Ce, Bi, Sr, Mn, Li, Na, and K and a protonated nitrogenous base, p is 1 to 4, q is 1 to 4, r is 1 to 4, and p=q.times.r is satisfied),

(in the formula, R 13 and R 14 are the same or different, each being an alkyl group with a carbon number of 1 to 6 or an aryl group with a carbon number of 6 to 12 which is straight- or branch-chained, R 15 is an alkylene group with a carbon number of 1 to 10, an arylene group with a carbon number of 6 to 10, an alkylarylene group with a carbon number of 6 to 10, or an arylalkylene group with a carbon number of 6 to 10 which is straight- or branch-chained, M t+ is at least one ion selected from ionized Mg, Ca, Al, Sb, Sn, Ge, Ti, Zn, Fe, Zr, Ce, Bi, Sr, Mn, Li, Na, and K and a protonated nitrogenous base, s is 1 to 4, t is 1 to 4, u is 1 to 4, and 2.times.s=t.times.u is satisfied); and

an organophosphorus compound represented by the following formula (9)

8. The photosensitive thermosetting resin composition according to claim 1 , wherein per 100 parts by mass of (A) said resin component soluble in the dilute alkali solution, 1 to 100 parts by mass of (B) said phosphorus-containing epoxy thermosetting component, 1 to 50 parts by mass of (C) said photopolymerization initiator, 1 to 50 parts by mass of (D) said phosphazene compound, and 1 to 100 parts by mass of (E) said diluent are contained.

9. A flexible printed circuit board including a polyimide layer and a copper layer or including a polyimide layer, an adhesive layer, and a copper layer, the flexible printed circuit board comprising: a resin layer provided on a surface of the flexible printed circuit board and made of the photosensitive thermosetting resin composition according to claim 1 .

10. The photosensitive thermosetting resin composition according to claim 1 , further comprising an epoxy resin curing agent other than component (B).

11. The photosensitive thermosetting resin composition according to claim 10 , wherein the epoxy resin curing agent other than component (B) is present in an amount of from 0.01 to 25 parts by mass, based on 100 parts by mass of component (A).

12. The photosensitive thermosetting resin composition according to claim 10 , wherein the epoxy resin curing agent other than component (B) is present in an amount of from 0.1 to 15 parts by mass, based on 100 parts by mass of component (A).

13. The photosensitive thermosetting resin composition according to claim 10 , wherein the phosphazene compound is a cyano phenoxy phosphazene compound.

14. The photosensitive thermosetting resin composition according to claim 10 , wherein the phosphazene compound is a cyanate phenoxy phosphazene compound.