Lithographically defined adhesion microstructures
A method for adhering two layers of materials is described. An additional layer of material deposited on one of the layers is used. The additional layer of material is perforated and undercut by etching away one of the layers thereby generating anchor shaped holes. The other layer is then deposited on the additional layer filling the anchor shaped holes therefore, providing adhesion.
1. A method for adhering two layers of material, comprising:
providing a first layer of material;
providing a second layer of material different from the first layer of material;
providing a third material;
depositing the second layer of material on the first layer of material;
performing one or more perforations through the second layer of material to expose the first layer of material through the one or more perforations;
undercutting the second layer of material through at least one of the one or more perforations to provide at least one anchor shaped hole in the first layer, the at least one anchor shaped hole having a width larger than the at least one of the one or more perforations; and
depositing the third material on the undercut second layer of material thus filling the at least one anchor shaped hole by the third material.
2. The method of claim 1 , wherein the third material is a liquified third material.
3. The method of claim 1 , wherein the second layer of material is deposited on the first layer of material by wafer-bonding, chemical vaporing, or sputtering.
4. The method of claim 1 , wherein the third material is deposited on the second layer of material by spin-coating.
5. The method of claim 1 , wherein the third material is deposited on the second layer of material by reflowing.
6. The method of claim 1 , wherein the third material is deposited on the second layer of material by applying a vacuum pump to exhaust air pockets left in the at least one anchor shaped hole thereby forcing the third material to fill the at least one anchor shaped hole.
7. A method for adhering a microfluidic chip to a substrate comprising:
providing a substrate;
providing a protection layer;
providing a microfluidic chip;
depositing the protection layer on the substrate;
performing one or more perforations through the protection layer to expose the substrate layer through the one or more perforations;
undercutting the protection layer through at least one of the one or more perforations to provide at least one anchor shaped hole having a width larger than the at least one of the one or more perforations; and
depositing the microfluidic chip on the protection layer thus filling the at least one anchor shaped hole by a portion of the microfluidic chip.
8. The method of claim 7 , wherein the microfluidic chip is deposited on the protection layer by reflowing.
9. The method of claim 7 , wherein the microfluidic chip is deposited on the protection layer by spin-coating.
10. The method of claim 7 , wherein the microfluidic chip is deposited on the protection layer by applying a vacuum pump to exhaust air pockets left in the at least one anchor shaped hole thereby forcing the third material to fill the at least one anchor shaped hole.
11. The method of claim 1 , wherein the first and second material have dissimilar brittleness.