IP Library Granted Patent US 8,242,514
Granted Patent B2
US 8,242,514 · App. 12/634,120 · Granted Aug 14, 2012

Semiconductor light emitting diode

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Quick Facts
Patent No.
US 8,242,514
App. No.
12/634,120
Granted
Aug 14, 2012
Kind
B2
Abstract

A semiconductor LED and a method manufacturing the semiconductor LED are disclosed. The method can include: forming a light emitting structure, which includes an N-type semiconductor layer, an active layer, and a P-type semiconductor layer stacked together, on a substrate; processing a division groove in the shape of a dotted line from the direction of the substrate or from the direction of the light emitting structure; and dividing the substrate and the light emitting structure along the division groove by applying pressure to at least one of the substrate and the light emitting structure. Embodiments of the invention can prevent total reflection for light emitted through the sides, and as a result, the light emitting efficiency can be improved.

Claims (9)

1. A semiconductor light emitting diode comprising a light emitting structure, the light emitting structure comprising an N-type semiconductor layer, an active layer, and a P-type semiconductor layer stacked together,

wherein a first region and a second region having different levels of surface roughness are repeatedly formed on at least one side surface of the light emitting structure, the side surface forming an outer circumference of the light emitting structure.

2. The semiconductor light emitting diode of claim 1 , further comprising a substrate stacked on a lower surface of the N-type semiconductor layer, wherein the first region and the second region are formed repeatedly on at least one side of the substrate.

3. The semiconductor light emitting diode of claim 1 , wherein the light emitting structure has a portion thereof removed by mesa etching between the P-type semiconductor layer and including a part of the N-type semiconductor layer.

4. The semiconductor light emitting diode of claim 1 , wherein the first region and the second region are formed alternately on at least one side of the light emitting structure.

5. The semiconductor light emitting diode of claim 1 , wherein the second region has a protrusion formed on at least one side of the light emitting structure.

6. The semiconductor light emitting diode of claim 5 , wherein the first region is smoother than the second region.

7. The semiconductor light emitting diode of claim 1 , wherein the first region and the second region are formed at regular intervals on at least one side of the light emitting structure.

8. The semiconductor light emitting diode of claim 2 , wherein the first region on at least one side of the substrate and the first region on the light emitting structure are formed to be coplanar.

Assignments (3)
MERGER Recorded Aug 7, 2012
From: SAMSUNG LED CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 028744/0272 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 22, 2010
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG LED CO., LTD.
Reel/Frame 024723/0532 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 9, 2009
From: JOUNG, IL-KWEON
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 023628/0578 →