Package structure of light emitting device
A package structure of a light emitting device includes a device substrate, at least a light emitting device, and a cover structure. The cover structure includes a cover substrate, a blocking dam, a sealant and an encapsulation glue. The blocking dam, disposed in a peripheral region of the cover substrate, faces the device substrate and substantially surrounds an active region of the cover substrate. The sealant, disposed in the peripheral region, faces the device substrate and substantially surrounds the blocking dam. The cover substrate and the device substrate are bonded together by virtue of the sealant. The encapsulation glue, blocked by the blocking dam, is substantially disposed in the active region of the cover substrate, and covers at least a part of the light emitting device.
1. A package structure of a light emitting device, the package structure comprising:
a device substrate having an active region and a peripheral region surrounding the active region at least a light emitting device disposed in the active region of the device substrate; and
a cover structure comprising:
a cover substrate having an active region and a peripheral region surrounding the active region, wherein the active region of the cover substrate corresponds to the active region of the device substrate, and the peripheral region of the cover substrate corresponds to the peripheral region of the device substrate;
a blocking dam disposed in the peripheral region of the cover substrate and facing the device substrate, wherein the blocking dam substantially surrounds the active region of the cover substrate;
a sealant disposed in the peripheral region of the cover substrate and facing the device substrate, wherein the sealant substantially surrounds the blocking dam, and the cover substrate is bonded to the device substrate through the sealant;
a buffer space, disposed between the blocking dam and the sealant, and between the cover substrate and the device substrate; and
an encapsulation glue, wherein the encapsulation glue is blocked by the blocking dam and substantially in the active region of the cover substrate, and the encapsulation glue covers at least a part of the light emitting device.
2. The package structure of the light emitting device of claim 1 , wherein the blocking dam has an enclosed pattern.
3. The package structure of the light emitting device of claim 1 , wherein the sealant has an enclosed pattern.
4. The package structure of the light emitting device of claim 1 , wherein the height of the blocking dam is substantially identical to the height of the sealant.
5. The package structure of the light emitting device of claim 1 , wherein the height of the blocking dam is substantially between 5 micrometers and 20 micrometers.
6. The package structure of the light emitting device of claim 1 , wherein the height of the sealant is substantially between 5 micrometers and 20 micrometers.