Device for protecting the pins of an electronic component
The invention relates to a protective device for an electronic component including at least one pin to be electrically connected to an electronic system. The device includes at least one flexible printed circuit including first and second opposite surfaces, a central portion including a through opening for receiving the pin, and flaps connected to the central portion. The printed circuit is made of two insulation layers and includes at least one first conducting track between the two insulating layers, connecting the pin to the electronic system, a second conducting track extending on the first surface, and a third conducting track extending on the second surface. The flaps are folded back at least partially onto each other in order to encapsulate the pin and to electrically connect the second and third conducting tracks.
1. A device for protecting an electronic component comprising at least one pin to be electrically connected to an electronic system, the device comprising at least one flexible printed circuit comprising first and second opposite surfaces, a central portion comprising a through opening into which the pin is to be inserted, and flaps connected to the central portion, the flexible printed circuit being at least partly formed of the stack of two insulating layers and comprising at least a first conductive track between the two insulating layers, for electrically connecting the pin to the electronic system, a second conductive track extending on the first surface, and a third conductive track extending on the second surface, the flaps being capable of being at least partly folded back on one another to encapsulate the pin, the second and third conductive tracks being capable of being electrically connected to each other at least when the flaps are at least partly folded back on one another, whereby the second and third conductive tracks form at least a portion of a protection track to be electrically connected to the electronic system.
2. The device of claim 1 , comprising a spacer capable of being arranged between the central portion and the flaps.
3. The device of claim 2 , wherein the spacer comprises an additional opening into which the pin is to be inserted.
4. The device of claim 2 , wherein the spacer comprises a threaded opening, the device comprising a screw having a threaded rod capable of cooperating with the threaded opening and a head capable of applying said flaps against the spacer.
5. The device of claim 1 , wherein the second and third conductive tracks are made of carbon.
6. The device of claim 1 , wherein the third conductive track comprises a widened conductive portion at the level of a first flap from among said flaps, the widened conductive portion being capable of being glued to the first surface of a second flap from among said flaps.
7. The device of claim 1 , wherein the second conductive track comprises a first conductive land at the level of a first flap from among said flaps and wherein the third conductive track comprises a second conductive land at the level of a second flap from among said flaps, the first and second flaps being capable of being folded back against each other to put the first conductive land in electric contact with the second conductive land.
8. A method for protecting an electronic component comprising at least one pin to be electrically connected to an electronic system, the method comprising the steps of:
providing a protection device comprising at least one flexible printed circuit comprising first and second opposite surfaces, a central portion comprising a through opening, and flaps connected to the central portion, the flexible printed circuit being at least partly formed of the stack of two insulating layers and comprising at least a first conductive track between the two layers, a second conductive track extending on the first surface, and a third conductive track extending on the second surface;
inserting the pin into the opening;
connecting the first conductive track to the pin; and
at least partly folding back the flaps against one another to encapsulate the pin, the second and third conductive tracks being capable of being electrically connected to each other at least when the flaps are at least partly folded back on one another, whereby the second and third conductive tracks form a protection track to be electrically connected to the electronic system.
9. The method of claim 8 , further comprising the steps of arranging a spacer against the central portion and of at least partly folding back the flaps against the spacer.
10. The method of claim 8 , wherein the third conductive track comprises a widened conductive portion at the level of a first flap from among said flaps, the method further comprising the step of gluing the widened conductive portion to the first surface of a second flap from among said flaps.