Sensor-based thermal specification enabling a real-time metric for compliance

1. A computing system comprising:

an integrated circuit die including a plurality of fuses, a plurality of temperature sensors and a control unit integrated onto the die, the plurality of fuses defining a thermal specification and the control unit to calculate an average die temperature based on readings from the plurality of temperature sensors, calculate a difference between the average die temperature and a specification temperature, and calculate a time-averaged value of the difference between the average die temperature and the specification temperature; and

a thermal management system to use a real-time control signal to adjust a cooling setting of a cooling system based on the time-averaged value.

2. The computing system of claim 1 , wherein the control unit is to further calculate the specification temperature from the plurality of fuses based on a power level of the die.

3. The computing system of claim 1 , wherein the control unit is to apply weights to the readings.

4. The computing system of claim 3 , wherein the die further includes a processor core, the control unit to apply the weights based on locations of individual temperature sensors relative to a footprint of the processor core.

5. The computing system of claim 3 , wherein the die further includes a plurality of processor cores, the control unit to apply the weights based on locations of individual temperature sensors relative to a footprint of active processor cores.

6. An integrated circuit die comprising:

a plurality of temperature sensors;

a control unit, the control unit to calculate an average die temperature based on readings from the plurality of temperature sensors; and

a plurality of fuses defining a thermal specification the control unit to further calculate a difference between the average die temperature and a specification temperature, wherein the control unit is to further calculates a time-averaged value of the difference between the average die temperature and the specification temperature.

7. The integrated circuit die of claim 6 , wherein the control unit is to further generate a real-time cooling system control signal based on the time-averaged value.

8. The integrated circuit die of claim 6 , wherein the control unit is to further calculate the specification temperature from the plurality of fuses based on a power level of the die.

9. The integrated circuit die of claim 6 , wherein the control unit is to apply weights to the readings.

10. The integrated circuit die of claim 9 , wherein the die further includes a processor core, the control unit to apply the weights based on locations of individual temperature sensors relative to a footprint of the processor core.

11. The integrated circuit die of claim 9 , further including a plurality of processor cores, the control unit to apply the weights based on locations of individual temperature sensors relative to a footprint of active processor cores.

12. A method comprising:

using an integrated circuit of a die to calculate an average die temperature based on readings from a plurality of temperature sensors integrated onto the die;

calculating a difference between the average die temperature and a thermal specification temperature defined by a plurality of fuses integrated onto the die; and calculating a time-averaged value of the difference between the average die temperature and the thermal specification temperature.

13. The method of claim 12 , further comprising:

generating a real-time cooling system control signal based on the time-averaged value.

14. The method of claim 12 , further including applying weights to the readings.

15. The method of claim 14 , further including applying the weights based on locations of individual temperature sensors relative to a footprint of a processor core that is integrated onto the die.

16. The method of claim 14 , further including applying the weights based on locations of individual temperature sensors relative to a footprint of active processor cores that are integrated onto the die.