Microfabricated pillar fins for thermal management
An electrical package with improved thermal management. The electrical package includes a die having an exposed back surface. The package further includes a plurality of fins extending outwardly from the back surface for dissipating heat from the package. The die can be arranged in a multi-die stacking configuration. In another embodiment, a method of forming a die for improved thermal management of an electrical package is provided.
1. An electrical package, comprising:
a die having an outer surface;
a metallic seed layer disposed on the outer surface; and
a fin integrally formed from the metallic seed layer and extending outwardly therefrom for dissipating heat from the package.
2. The electrical package of claim 1 , wherein the fin is formed of a conductive material.
3. The electrical package of claim 1 , wherein the fin has a cylindrical, square, or rectangular cross-section.
4. The electrical package of claim 1 , wherein the fin comprises a plurality of fins.
5. The electrical package of claim 4 , further comprising a channel defined. between the plurality of fins.
6. The electrical package of claim 4 , wherein the plurality of fins substantially occupy the outer surface of the die.
7. The electrical package of claim 4 , wherein the cross section of each of the plurality of fins is substantially similar to the shape of the outer surface.
8. The electrical package of claim 1 , wherein the fin has an aspect ratio between about 3:1 to about 10:1.
9. The electrical package of claim 1 , further comprising a via formed in the die.
10. The electrical package of claim 1 , wherein the metallic seed layer is exposed to the surrounding environment.
11. An electrical package, comprising:
a plurality of dies each of which has an outer surface;
a metallic seed layer disposed on the outer surface of each of the plurality of dies; and
a plurality of fins extending outwardly from the metallic seed layer of at least one die;
wherein, the plurality of dies are coupled to one another and stacked within the package.
12. The electrical package of claim 11 , wherein the plurality of fins is integrally formed from the metallic seed layer disposed on the at least one die.
13. The electrical package of claim 11 , wherein the plurality of dies comprises an upper die and a lower die, the upper die coupled to the lower die by a plurality of microbumps.
14. The electrical package of claim 13 , wherein the plurality of fins extends outwardly from the surface of the upper die and from a portion of the surface of the lower die.
15. The electrical package of claim 13 , wherein a back surface of the lower die comprises a plurality of microbumps for coupling to the upper die and a front surface of the lower die comprises a plurality of microbumps for coupling to an electronic device.
16. The electrical package of claim 15 , wherein a portion of the back surface of the lower die comprises a plurality of fins extending outwardly therefrom.
17. An electrical package, comprising:
a die having an outer surface;
a metallic seed layer disposed on the outer surface; and
means for dissipating heat from the die;
wherein, the means for dissipating is integrally formed from the metallic seed layer.
18. The electrical package of claim 17 , wherein the means for dissipating extends outwardly from the metallic seed layer.
19. The electrical package of claim 17 , wherein:
the die comprises a plurality of dies each of which has an outer surface;
the metallic seed layer is disposed on the outer surface of the plurality of dies; and
the means for dissipating is integrally formed from the metallic seed layer on at least one of the plurality of dies.
20. The electrical package of claim 17 incorporated into a device selected from a group consisting of a music player, a video player, an entertainment unit, a navigation device, a communications device, a personal digital assistant (PDA), a fixed location data unit, and a computer.