Microalignment using laser-softened glass bumps
Disclosed is a method for fabricating glass bump standoff structures of precise height, the method comprising providing oversized glass bumps on a glass substrate, providing a heat source to heat the bumps, positioning a substrate to be aligned on the oversized bumps, and reducing the height of the oversized bumps by a combination of manipulations comprising (1) softening the bumps by heating the bumps and (2) applying pressure to the substrate to be aligned.
1. A method for fabricating glass bump standoff structures of precise height for substrate alignment, the method comprising:
positioning a glass substrate on an alignment substrate;
providing oversized glass bumps on the glass substrate by irradiating the glass substrate with a laser to form the oversized bumps;
providing a heat source to heat the bumps;
positioning a substrate to be aligned on the oversized bumps;
reducing the height of the oversized bumps by a combination of manipulations comprising (1) softening the bumps by heating the bumps and (2) applying pressure to the substrate to be aligned; and
supporting the substrate to be aligned on the glass bump standoff structures formed by the reducing step for alignment with another substrate,
wherein the step of reducing the bump height includes laser irradiating the bumps through the alignment substrate.
2. The method according to claim 1 wherein the heat source is an irradiation beam in combination with the glass substrate being absorbing at a wavelength of the irradiation beam.
3. The method according to claim 2 wherein the irradiation beam is a 1.55 μm laser.
4. The method according to claim 1 wherein the substrate to be aligned comprises silicon.
5. The method according to claim 1 wherein the glass substrate comprises a dark glass.
6. The method according to claim 1 wherein the glass bumps comprise a dark glass.
7. The method according to claim 1 wherein the glass bumps are formed during the positioning of the substrate to be aligned.