Mounting method using dilatancy fluid
View Patent ↗Even pressure is applied to a mounting target, even in a case where electronic components having different heights from each other are attempted to be mounted to a substrate, or in a case where an electronic component is attempted to be mounted to a substrate whose rear surface is provided with another electronic component. A mounting device 100 includes a lower pressurizing section 102 as a first pressurizing section and an upper pressurizing section 104 as a second pressurizing section, and pressurizes a substrate, a plurality of electronic components, and the like, sandwiched between the lower pressurizing section 102 and the upper pressurizing section 104, thereby mounting the substrate to the plurality of electronic components. The lower pressurizing section 102 or the upper pressurizing section 104 includes a dilatancy fluid 116.
1. A mounting method, comprising:
preparing a first mounting target and a second mounting target;
adjusting a relative positional relation between the first mounting target and the second mounting target; and
sandwiching and pressurizing, via a cover sheet, the first mounting target and the second mounting target between a first pressurizing section and a second pressurizing section, thereby mounting the first mounting target and the second mounting target to each other; and
carrying the cover sheet, wherein
the first pressurizing section and the second pressurizing section are substantially flat,
the first pressurizing section includes a dilatancy fluid,
the second pressurizing section is provided above the first pressurizing section,
the cover sheet covers an upper surface of the dilatancy fluid, and
carrying the cover sheet includes a leveling section provided to an end of the first pressurizing section restraining the dilatancy fluid from being carried away with the cover sheet.
2. The mounting method according to claim 1 , wherein
the first pressurizing section or the second pressurizing section includes a heating section for heating the first mounting target or the second mounting target, and
sandwiching and pressurizing, via the cover sheet, the first mounting target and the second mounting target between the first pressurizing section and the second pressurizing section includes sandwiching, via the cover sheet, the first mounting target and the second mounting target between the first pressurizing section and the second pressurizing section and pressurizing and heating the first mounting target and the second mounting target.
3. The mounting method according to claim 1 , after adjusting the relative positional relation, further comprising:
arranging the first mounting target, an anisotropic conductive film, and the second mounting target, in the stated order.
4. A mounting method, comprising:
preparing a first mounting target and a second mounting target;
adjusting a relative positional relation between the first mounting target and the second mounting target; and
sandwiching and pressurizing, via a cover sheet, the first mounting target and the second mounting target between a first pressurizing section and a second pressurizing section, thereby electrically connecting a conductive section of the first mounting target to a conductive section of the second mounting target; and
carrying the cover sheet, wherein
the first pressurizing section and the second pressurizing section are substantially flat,
the first pressurizing section includes a dilatancy fluid,
the second pressurizing section is provided above the first pressurizing section,
the cover sheet covers an upper surface of the dilatancy fluid, and
carrying the cover sheet includes a leveling section provided to an end of the first pressurizing section restraining the dilatancy fluid from being carried away with the cover sheet.
5. The mounting method according to claim 4 , wherein
the first pressurizing section or the second pressurizing section includes a heating section for heating the first mounting target or the second mounting target, and
sandwiching and pressurizing, via the cover sheet, the first mounting target and the second mounting target between the first pressurizing section and the second pressurizing section includes sandwiching, via the cover sheet, the first mounting target and the second mounting target between the first pressurizing section and the second pressurizing section and pressurizing and heating the first mounting target and the second mounting target.
6. The mounting method according to claim 4 , after adjusting the relative positional relation, further comprising:
arranging the first mounting target, an anisotropic conductive film, and the second mounting target, in the stated order.