Semiconductor device having wiring layer with a wide wiring and fine wirings
View Patent ↗Provided is a semiconductor device having a wiring layer formed of damascene wiring. The semiconductor device includes: a first wiring having a width equal to or larger than 0.5 μm; a second wiring adjacent to the first wiring and arranged with a space less than 0.5 μm from the first wiring; and a third wiring adjacent to the second wiring and arranged with a space equal to or smaller than 0.5 μm from the first wiring. In the semiconductor device, the second wiring and the third wiring are structured to have the same electric potential.
1. A semiconductor device including a wiring layer formed of damascene wiring, comprising:
a first wiring having a width, in a first direction, equal to or larger than 0.5 μm;
a second wiring adjacent to the first wiring in the first direction and arranged with a non-zero space less than 0.5 μm from the first wiring in the first direction; and
a third wiring adjacent to the second wiring in the first direction and arranged with a non-zero space equal to or smaller than 0.5 μm from the first wiring in the first direction,
wherein the second wiring and the third wiring are structured to have the same electric potential, and
wherein the first wiring and the second wiring are structured to have different potentials.
2. The semiconductor device according to claim 1 , wherein the space between the first wiring and the second wiring is equal to or larger than 0.2 μm in the first direction.
3. The semiconductor device according to claim 1 , wherein the first wiring, the second wiring, and the third wiring are arranged parallel to one another.
4. The semiconductor device according to claim 1 , wherein a wiring pitch between the second wiring and the third wiring is less than 0.15 μm.
5. The semiconductor device according to claim 1 , wherein the second wiring and the third wiring are formed at a minimum pitch of less than 0.15 μm in the semiconductor device.
6. The semiconductor device according to claim 1 , wherein the second wiring and the third wiring each have a ground potential.
7. The semiconductor device according to claim 1 , wherein the second wiring and the third wiring each have a power supply potential.
8. The semiconductor device according to claim 1 , wherein the first wiring, the second wiring, and the third wiring comprise copper containing metal.
9. The semiconductor device according to claim 1 , wherein:
the first wiring, the second wiring, and the third wiring are arranged parallel to one another;
the space between the first wiring and the second wiring is equal to or larger than 0.2 μm in the first direction; and
a wiring pitch between the second wiring and the third wiring is less than 0.15 μm.
10. The semiconductor device according to claim 9 , wherein the second wiring and the third wiring each have a ground potential.
11. The semiconductor device according to claim 9 , wherein the second wiring and the third wiring each have a power supply potential.
12. The semiconductor device according to claim 1 , wherein:
the first wiring, the second wiring, and the third wiring are arranged parallel to one another;
the space between the first wiring and the second wiring is equal to or larger than 0.2 μm in the first direction; and
the second wiring and the third wiring are formed at a minimum pitch of less than 0.15 μm.
13. The semiconductor device according to claim 12 , wherein the second wiring and the third wiring each have a ground potential.
14. The semiconductor device according to claim 12 , wherein the second wiring and the third wiring each have a power supply potential.
15. A semiconductor device including a wiring layer formed of damascene wiring, comprising:
a first wiring having a width, in a first direction, equal to or larger than 0.5 μm;
a second wiring adjacent to, and spaced apart from, the first wiring in the first direction; and
a third wiring adjacent to, and spaced apart from the second wiring, the third wiring arranged, in the first direction, with a non-zero space equal to or smaller than 0.5 μm from the first wiring such that the second wiring is arranged, in the first direction, between the first wiring and the third wiring,
wherein the second wiring and the third wiring are structured to have the same electric potential, and
wherein the first wiring and the second wiring are structured to have different potentials.
16. The semiconductor device according to claim 15 , wherein the space between the first wiring and the second wiring is equal to or larger than 0.2 μm in the first direction.
17. The semiconductor device according to claim 15 , wherein a wiring pitch between the second wiring and the third wiring is less than 0.15 μm.
18. The semiconductor device according to claim 15 , wherein the first wiring, the second wiring, and the third wiring are arranged parallel to one another.