Micro cross-section processing method
View Patent ↗A micro cross-section processing method includes the steps of determining a linear cross-section estimated position including an observation object on a surface of the sample, irradiating the focused ion beam to the cross-section estimated position perpendicularly to or at a tilt angle to form a cross-section at a position in front of the cross-section estimated position, irradiating the focused ion beam to both ends of the cross-section to form side cuts extending to a position in rear of the cross-section estimated position, irradiating the focused ion beam to a position on the surface of the cross-section and at a position deeper than the observation object to form a bottom cut extending to a position in rear of the cross-section estimated position, irradiating the focused ion beam along from the side cuts to the cross-section estimated position to form wedges connecting to the bottom cut, and applying impact to a region in front of the cross-section estimated position of the sample to cleave the vicinity of the cross-section estimated position between the wedges and form a plane of cleavage.
1. A micro cross-section processing method that uses a focused ion beam system to irradiate a focused ion beam to a sample and performs cross-section processing on the sample, the method comprising:
a processing-estimated-position determining step of determining a linear cross-section estimated position including an observation object on a surface of the sample;
a cross-section processing step of irradiating the focused ion beam to the cross-section estimated position with the direction of launching perpendicular to or at a tilt angle to the surface of the sample to form a cross-section at a position in front of the cross-section estimated position;
a side-cut processing step of irradiating the focused ion beam to both ends of the cross-section to form side cuts extending to a position in rear of the cross-section estimated position at both ends;
a bottom-cut processing step of irradiating the focused ion beam to a position on the surface of the cross-section and at a position deeper than the observation object to form a bottom cut extending to a position in rear of the cross-section estimated position and connecting to the side cuts;
a wedge processing step of irradiating the focused ion beam along from the side cuts to the cross-section estimated position to form wedges extending inwardly from both ends of the cross-section and connecting to the bottom cut; and
an observation-cross-section processing step of applying impact to a region in front of the cross-section estimated position of the sample to cleave the vicinity of the cross-section estimated position between the wedges and form a plane of cleavage.
2. The micro cross-section processing method according to claim 1 , the method further comprising an overcoat forming step of, when the observation object is positioned on the sample surface, forming an overcoat to cover the observation object on the surface of the sample before irradiating the focused ion beam.
3. The micro cross-section processing method according to claim 1 , wherein the wedge processing step includes separating the pointed ends of the wedges from the observation object by 0.5 μm or more.
4. The micro cross-section processing method according to claim 1 , further comprising an observation-object position displaying step of, when the observation object is positioned inside the sample, displaying the position of the observation object on the surface of the sample before the processing-estimated-position determining step.