Thin film transistor, method of fabricating the same and organic light emitting diode display device having the same
A thin film transistor, a method of fabricating the same, and an OLED display device having the same. The thin film transistor includes a substrate, a semiconductor layer disposed on the substrate and having a channel region, source and drain regions, and a body contact region, a gate insulating layer disposed on the semiconductor layer to expose the body contact region, a silicon layer disposed on the gate insulating layer and contacting the body contact region exposed by the gate insulating layer, a gate electrode disposed on the silicon layer, an interlayer insulating layer disposed on the gate electrode, and source and drain electrodes disposed on the interlayer insulating layer and electrically connected with the source and drain regions, wherein the body contact region is formed in an edge region of the semiconductor layer.
1. A thin film transistor, comprising:
a substrate;
a semiconductor layer disposed on the substrate, comprising a channel region, source and drain regions, and a first body contact region formed at a first edge of the semiconductor layer;
a gate insulating layer disposed on the semiconductor layer and exposing the first body contact region;
a silicon layer disposed such that the gate insulating layer is between the silicon layer and the channel region of the semiconductor layer, the silicon layer contacting the first body contact region;
a gate electrode disposed on the silicon layer;
an interlayer insulating layer disposed on the gate electrode; and
source and drain electrodes disposed on the interlayer insulating layer and electrically connected with the source and drain regions, respectively,
wherein the first body contact region is connected with the channel region, and
wherein the silicon layer includes a first type of impurity, and the source and drain regions include a second type of impurity, the first and second types of impurities having opposite conductivities.
2. The thin film transistor according to claim 1 , wherein a width of the gate insulating layer formed in the channel region of the semiconductor layer is less than the width of the channel region of the semiconductor layer.
3. The thin film transistor according to claim 1 , wherein a width of the body contact region is more than 0 and not more than 0.1 μm.
4. The thin film transistor according to claim 1 , wherein the first type of impurity is an n-type impurity, and the semiconductor layer is crystallized using a crystallization-inducing metal.
5. The thin film transistor according to claim 1 , wherein the semiconductor layer further comprises a second body contact region formed in a second edge of the semiconductor layer, the second edge of the semiconductor layer being opposite the first edge of the semiconductor layer.
6. The thin film transistor according to claim 5 , wherein the first and second body contact regions have a same length as the channel region of the semiconductor layer.
7. The thin film transistor according to claim 5 , wherein the silicon layer covers the channel region and the first and second body contact regions.
8. A method of fabricating a thin film transistor, comprising:
forming a semiconductor layer on a substrate;
forming a gate insulating layer on the semiconductor layer to expose a part of an edge region of the semiconductor layer;
forming a silicon layer on the gate insulating layer and the edge region of the semiconductor layer;
injecting an impurity into the silicon layer;
forming a gate electrode on the silicon layer in an area thereof corresponding to the semiconductor layer;
forming an interlayer insulating layer on the gate electrode; and
forming source and drain electrodes on the interlayer insulating layer electrically connected to source and drain regions of the semiconductor layer.
9. The method according to claim 8 , wherein the edge region of the semiconductor layer exposed by the gate insulating layer includes an edge region connected with a channel region of the semiconductor layer.
10. The method according to claim 8 , wherein the exposed edge region of the semiconductor layer is more than 0 and not more than 0.1 μm.
11. The method according to claim 8 , wherein the injecting of the impurity into the silicon layer further comprises:
injecting an impurity having a conductivity type opposite to a conductivity type of an impurity in source and drain regions of the semiconductor layer.
12. The method according to claim 8 , wherein the injecting of the impurity into the silicon layer further comprises:
injecting the impurity into the silicon layer using the gate electrode as a mask.
13. The method according to claim 8 , further comprising:
forming the semiconductor layer by crystallizing an amorphous silicon layer into a polycrystalline silicon layer using a crystallization-inducting metal;
injecting an n-type impurity into the exposed edge region of the semiconductor layer using the gate insulating layer as a mask; and
annealing the substrate and gettering the crystallization-inducing metal remaining in the semiconductor layer to the region into which the n-type impurity is injected.
14. The method according to claim 13 , wherein the substrate is annealed for about 30 seconds to 10 hours at a temperature of about 450 to 900 ° C.
15. An organic light emitting diode (OLED) display device, comprising:
a substrate;
a semiconductor layer disposed on the substrate comprising: a channel region, source and drain regions, and a body contact region formed at a first edge of the semiconductor layer;
a gate insulating layer disposed on the semiconductor layer and exposing the body contact region;
a silicon layer disposed such that the gate insulating layer is between the silicon layer and the channel region of the semiconductor layer, the silicon layer contacting the first body contact region;
a gate electrode disposed on the silicon layer;
an interlayer insulating layer disposed on the gate electrode;
source and drain electrodes disposed on the interlayer insulating layer and electrically connected with the source and drain regions, respectively;
a first electrode electrically connected to one of the source and drain electrodes;
an organic layer disposed on the first electrode and comprising a light emitting layer; and
a second electrode disposed on the organic layer,
wherein the silicon layer includes an impurity having a first conductivity type, and the source and drain regions include an impurity having a second conductivity type, the first and second conductivity types being opposite.
16. The OLED display device according to claim 15 , wherein the first body contact region is connected with the channel region.
17. The OLED display device according to claim 16 , wherein a width of the gate insulating layer formed in the channel region is less than the width of the channel region.
18. The OLED display device according to claim 16 , wherein a width of the body contact region is more than 0 and not more than 0.1 μm.
19. The OLED display device according to claim 15 , wherein the silicon layer includes an n-type impurity, and the semiconductor layer is crystallized using a crystallization-inducing metal.
20. The OLED display device according to claim 15 , further comprising:
a second body contact region formed in a second edge of the semiconductor layer, the second edge of the semiconductor layer being opposite the first edge of the semiconductor layer.