Method of repairing probe pads
View Patent ↗A method that includes forming a first level of active circuitry on a substrate, forming a first probe pad electrically connected to the first level of active circuitry where the first probe pad having a first surface, contacting the first probe pad with a probe tip that displaces a portion of the first probe pad above the first surface, and performing a chemical mechanical polish on the first probe pad to planarize the portion of the first probe pad above the first surface. The method also includes forming a second level of active circuitry overlying the first probe pad, forming a second probe pad electrically connected to the second level of active circuitry, contacting the second probe pad with a probe tip that displaces a portion of the probe pad, and chemically mechanically polishing the second probe pad to remove the portion displaced.
1. A device, comprising:
a substrate;
a first level of active circuitry formed on the substrate;
a first metal level coupled to the first level of active circuitry, the first metal level including:
a first probe pad having a first surface planarized by a first chemical mechanical polish, the first probe pad having a first indentation;
a portion of a first insulating layer in the first indentation, the first insulating layer having a second surface that is coplanar with the first surface of the first probe pad, the first indentation being partially filled by the portion of the first insulating layer; and
a second metal level coupled to the first metal level, the second metal level including:
a second probe pad having a third surface planarized by a second chemical mechanical polish.
2. The device of claim 1 wherein the first probe pad is formed overlying the first level of active circuitry.
3. The device of claim 1 wherein the second probe pad is formed overlying the first probe pad.
4. The device of claim 1 wherein the second probe pad is formed overlying the first level of active circuitry.
5. The device of claim 1 , further comprising a second insulating layer formed between the first metal level and the second metal level, a portion of the second insulating layer filling a remainder of the first indentation.
6. The device of claim 1 , further comprising a second indentation in the second probe pad.
7. The device of claim 6 , wherein the second indentation in the second probe pad is partially filled by a second insulating layer.
8. A device, comprising:
a substrate;
an integrated circuit formed on the substrate;
a first metal layer coupled to the integrated circuit, the first metal layer having a first surface, the first metal layer including:
a probe pad having the first surface, the probe pad including an indentation that extends below the first surface;
a first insulating layer on the first metal layer and including a first portion positioned in the indentation of the probe pad;
a second insulating layer, the indentation including the second insulating layer adjacent to the first portion of the first insulating layer, the second insulating layer having a second surface that is coplanar with the first surface; and
a second metal layer on the first insulating layer.
9. The device of claim 8 , further comprising a third insulating layer on the first metal layer, the third insulating layer having a third surface that is coplanar with a fourth surface of the second metal layer.
10. The device of claim 9 wherein the second metal layer includes a second probe pad.
11. The device of claim 10 wherein the second probe pad has a fourth surface positioned above the first surface.
12. A device, comprising:
a substrate;
an integrated circuit formed on the substrate;
a first metal layer coupled to the integrated circuit, the first metal layer having a first surface, the first metal layer including:
a probe pad having the first surface, the probe pad including an indentation that extends below the first surface;
a first insulating layer on the first metal layer and including a first portion positioned in the indentation of the probe pad;
a second insulating layer adjacent to the first metal layer, the second insulating layer having a second surface that is coplanar with the first surface; and
a second metal layer on the first insulating layer.