Transfer device for receiving and transferring a solder ball arrangement
View Patent ↗The present invention relates to a transfer device ( 10 ) for receiving and transferring a solder ball arrangement ( 28 ). Said transfer device comprises a discharge container ( 11 ) and a transfer substrate ( 12 ) that interacts with the discharge container in order to obtain a flat solder ball arrangement and that can be subjected to a negative pressure. The discharge container comprises an at least partially perforated base wall ( 14 ) and the transfer substrate has a hole pattern for receiving the solder ball arrangement. The discharge container comprises an ultrasound device ( 37 ) for subjecting said discharge container to ultrasound vibrations.
1. A transfer device for receiving and transferring a solder ball arrangement, the device comprising:
a discharge container having an annular peripheral wall coupled to a base wall formed of a wire mesh exhibiting a mesh size smaller than diameter of solder balls, wherein the discharge container includes a photoelectric barrier device provided with a transmitter and a receiver, each arranged on opposing locations in the peripheral wall;
a transfer substrate that interacts with the discharge container in order to obtain a flat solder ball arrangement, the transfer substrate having a hole pattern for receiving the solder ball arrangement;
a first ultrasound device coupled to the peripheral wall of the discharge container for subjecting said discharge container to ultrasound vibrations;
a solder ball reservoir operatively coupled to the discharge container for supplying solder balls to the discharge container;
a metering device coupled to the solder ball reservoir and coupling the solder ball reservoir to the discharge container, the metering device comprising an outlet nozzle and a second ultrasound device coupled to the outlet nozzle to subject the outlet nozzle to ultrasound vibrations, wherein the metering device interacts with said photoelectric barrier device, which defines a filling level, h, of the discharge container.
2. The transfer device of claim 1 further comprising:
a sealing device interposed between the transfer substrate and the discharge container.
3. The transfer device of claim 1 further comprising:
a supply device located below the base wall for supplying an ionized gas to the discharge container.
4. The transfer device of claim 2 further comprising:
a supply device located below the base wall for supplying an ionized gas to the discharge container.
5. The transfer device of claim 1 comprising:
a flexible feeding pipe coupling the metering device to the discharge container.
6. The transfer device of claim 1 further comprising:
a vacuum device coupled to the solder ball reservoir for subjecting the solder ball reservoir to a vacuum.
7. The transfer device of claim 1 further comprising: a sealing ring interposed between the peripheral wall and the transfer substrate.
8. The transfer device of claim 7 wherein,
the sealing ring is disposed on a frontal surface of the peripheral wall facing the transfer substrate.
9. The transfer device of claim 1 further comprising:
a filling level sensor coupled to the solder ball reservoir for detecting the fill level of the solder ball reservoir.
10. The transfer device of claim 1 further comprising:
a gas inlet coupled to the solder ball reservoir for controlling the air humidity within the solder ball reservoir.