Repairing defects

1. A method, comprising:

identifying a defect causing an absence of an electrical connection between a first circuit element and a second circuit element, the first and second circuit elements being positioned in or on a substrate and the defect being positioned in the substrate;

removing a portion of the substrate to expose the defect;

after exposing the defect, depositing a conductive material to electrically connect the first and second circuit elements; and

verifying that the defect caused the absence of an electrical connection between the first and second circuit elements.

2. The method of claim 1 , further comprising identifying the defect by obtaining an image of the first and second circuit elements comprising voltage contrast information.

3. The method of claim 1 , wherein identifying the defect comprises exposing the first and second circuit elements to a charged particle beam to cause particles to leave the substrate, and forming an image of the first and second circuit elements based on the particles that leave the substrate.

4. The method of claim 3 , wherein identifying the defect further comprises identifying a difference in intensity between the first and second circuit elements in the image.

5. The method of claim 3 , wherein the charged particle beam is an ion beam.

6. The method of claim 1 , wherein the first and second circuit elements comprise lines of conductive material, and the defect is positioned along a conductive path between the first and second circuit elements.

7. The method of claim 1 , wherein the first and second circuit elements are positioned in a common plane of the substrate.

8. The method of claim 1 , wherein the first and second circuit elements are positioned in different planes of the substrate.

9. The method of claim 1 , wherein removing a portion of the substrate to expose the defect further comprises exposing a region of the substrate comprising the defect to a charged particle beam to cause particles to leave the exposed region, and forming an image of the exposed region based on the particles that leave the region.

10. The method of claim 9 , wherein the charged particle beam comprises ions.

11. The method of claim 1 , wherein depositing the conductive material comprises directing a charged particle beam to be incident on the substrate, and directing gas molecules to be incident on the substrate in the same region as the charged particle beam.

12. The method of claim 1 , wherein depositing the conductive material comprises directing a charged particle beam to interact with a stream of gas molecules to deposit the conductive material to connect the first and second circuit elements.

13. The method of claim 1 , wherein verifying that the defect caused the absence of an electrical connection between the first and second circuit elements comprises, after depositing the conductive material, exposing at least one of the first and second circuit elements to a charged particle beam to cause particles to leave the substrate, and forming an image of the first and second circuit elements based on the particles that leave the substrate.

14. The method of claim 1 , wherein verifying that the defect caused the absence of an electrical connection between the first and second circuit elements comprises, during deposition of the conductive material, exposing at least one of the first and second circuit elements to a charged particle beam to cause particles to leave the substrate, and forming one or more images of the first and second circuit elements based on the particles that leave the substrate.

15. The method of claim 1 , wherein the portion of the substrate is removed without removing any portion of an electrical path comprising the defect.

16. The method of claim 1 , wherein the defect comprises an opening in an electrical path between the first and second circuit elements.

17. The method of claim 1 , wherein the defect comprises a variation in at least one dimension of an electrical path between the first and second circuit elements.

18. The method of claim 1 , further comprising providing information about the defect to a semiconductor fabrication system.

19. A method, comprising:

identifying a defect corresponding to an electrical connection between a first circuit element and a second circuit element, the first and second circuit elements being positioned in or on a substrate and the defect being positioned in the substrate;

removing a portion of the substrate to expose the defect;

after exposing the defect, removing the defect to electrically disconnect the first and second circuit elements; and

verifying that the first and second circuit elements are electrically disconnected.

20. A method, comprising:

identifying a suspected electrical defect positioned between a first circuit element and a second circuit element, the first and second circuit elements being positioned in or on a substrate and the suspected defect being positioned in the substrate;

removing a portion of the substrate to expose the suspected defect;

after exposing the suspected defect, exposing the suspected defect to a charged particle beam to modify at least a portion of the suspected defect; and

verifying that the suspected defect corresponds to a real defect.

21. A method, comprising:

identifying a defect causing an absence of an electrical connection between a first circuit element and a second circuit element, the first and second circuit elements being positioned in or on a substrate and the defect being positioned in the substrate;

removing a portion of the substrate to expose the defect;

depositing a conductive material to electrically connect the first and second circuit elements; and

verifying that the defect caused the absence of an electrical connection between the first and second circuit elements,

wherein:

identifying the defect comprises exposing the first and second circuit elements to a charged particle beam to cause particles to leave the substrate, and forming an image of the first and second circuit elements based on the particles that leave the substrate; and

identifying the defect further comprises identifying a difference in intensity between the first and second circuit elements in the image.

22. A method, comprising:

identifying a defect causing an absence of an electrical connection between a first circuit element and a second circuit element, the first and second circuit elements being positioned in or on a substrate and the defect being positioned in the substrate;

removing a portion of the substrate to expose the defect;

depositing a conductive material to electrically connect the first and second circuit elements; and

verifying that the defect caused the absence of an electrical connection between the first and second circuit elements,

wherein the first and second circuit elements comprise lines of conductive material, and the defect is positioned along a conductive path between the first and second circuit elements.

23. A method, comprising:

identifying a defect causing an absence of an electrical connection between a first circuit element and a second circuit element, the first and second circuit elements being positioned in or on a substrate and the defect being positioned in the substrate;

removing a portion of the substrate to expose the defect;

depositing a conductive material to electrically connect the first and second circuit elements; and

verifying that the defect caused the absence of an electrical connection between the first and second circuit elements,

wherein depositing the conductive material comprises directing a charged particle beam to be incident on the substrate, and directing gas molecules to be incident on the substrate in the same region as the charged particle beam.

24. A method, comprising:

identifying a defect causing an absence of an electrical connection between a first circuit element and a second circuit element, the first and second circuit elements being positioned in or on a substrate and the defect being positioned in the substrate;

removing a portion of the substrate to expose the defect;

depositing a conductive material to electrically connect the first and second circuit elements; and

verifying that the defect caused the absence of an electrical connection between the first and second circuit elements,

wherein depositing the conductive material comprises directing a charged particle beam to interact with a stream of gas molecules to deposit the conductive material to connect the first and second circuit elements.