IP Library › Granted Patent US 8,350,300
Granted Patent B2
US 8,350,300 · App. 12/782,889 · Granted Jan 8, 2013

Semiconductor device having air gaps in multilayer wiring structure

Assignee: Canon Kabushiki Kaisha
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Quick Facts
Patent No.
US 8,350,300
App. No.
12/782,889
Granted
Jan 8, 2013
Kind
B2
Abstract

A semiconductor device comprises a semiconductor substrate, and a multilayer wiring structure arranged on the semiconductor substrate, the multilayer wiring structure including a plurality of first electrically conductive lines, an insulating film covering the plurality of first electrically conductive lines, and a second electrically conductive line arranged on the insulating film so as to intersect the plurality of first electrically conductive lines, where the insulating film has gaps in at least some of a plurality of regions where the plurality of first electrically conductive lines and the second electrically conductive line intersect each other, and the width of the gap in a direction along the second electrically conductive line is not larger than the width of the first electrically conductive line.

Claims (11)

1. A semiconductor device comprising:

a semiconductor substrate including a photoelectric converter; and

a multilayer wiring structure arranged on said semiconductor substrate,

said multilayer wiring structure including:

a plurality of first electrically conductive lines;

an insulating film covering said plurality of first electrically conductive lines; and

a second electrically conductive line arranged on said insulating film so as to intersect said plurality of first electrically conductive lines,

wherein said insulating film has air gaps in at least some of a plurality of regions where said plurality of first electrically conductive lines and said second electrically conductive line intersect each other, and

said air gaps each have a width in a direction along said second electrically conductive line that is not larger than a width of a respective one of said plurality of first electrically conductive lines that is arranged below that air gap, and

wherein said semiconductor device includes a photoelectric conversion device.

2. The device according to claim 1 , wherein the width of each of said air gaps in a direction along said first electrically conductive line is not larger than a width of said second electrically conductive line.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 7, 2010
From: AOKI, TAKESHI
To: CANON KABUSHIKI KAISHA
Reel/Frame 024941/0704 →
Priority Claims (1)
JP 2009-137721 · Jun 8, 2009 · national
Continuity (1)
Related Publication 20100308430A1 · Dec 9, 2010