Duplexer for integration in communication terminals
There is described a duplexer comprising: a dielectric substrate having a circuit-receiving surface and an opposite surface; a ground structure deposited on the circuit-receiving surface or the opposite surface; a first filter connectable to a first terminal and having a first frequency bandpass; a second filter connectable to a second terminal and having a second frequency bandpass different from the first frequency bandpass, the first filter and the second filter each having at least one filter section deposited on the circuit-receiving surface; and an uncovered coupling circuit connectable to a third terminal and deposited on the circuit-receiving surface between the first filter and the second filter, the coupling circuit being spaced apart from the first and second filter by a coupling gap and configured for electromagnetically coupling the first filter and the second filter together.
1. A duplexer comprising:
a dielectric substrate having a circuit-receiving surface and an opposite surface;
a ground structure deposited on one of said circuit-receiving surface and said opposite surface;
a first filter connectable to a first terminal and having a first frequency bandpass;
a second filter connectable to a second terminal and having a second frequency bandpass different from said first frequency bandpass, said first filter and said second filter each having at least one filter section deposited on said circuit-receiving surface; and
an uncovered coupling circuit connectable to a third terminal and deposited on said circuit-receiving surface between said first filter and said second filter, the coupling circuit being spaced apart from said first and second filter by a coupling gap and configured for electromagnetically coupling said first filter and said second filter together in order to electromagnetically couple a first quasi-transverse electromagnetic (TEM) wave signal having a first frequency within said first frequency bandpass between said uncovered coupling circuit and said first filter, and a second quasi-TEM wave signal having a second frequency within said second frequency bandpass between said uncovered coupling circuit and said second filter.
2. The duplexer as claimed in claim 1 , wherein said ground structure comprises a ground layer deposited on said opposite surface so that said uncovered coupling circuit corresponds to a microstrip coupling circuit.
3. The duplexer as claimed in claim 1 , wherein said ground structure is deposited on said circuit-receiving surface so that said uncovered coupling circuit corresponds to a coplanar waveguide coupling circuit.
4. The duplexer as claimed in claim 1 , wherein said uncovered coupling circuit comprises a first uncovered strip line having a first width connected to a second uncovered strip line having a second width different from said first width.
5. The duplexer as claimed in claim 1 , wherein said coupling circuit comprises an uncovered and broken strip line.
6. The duplexer as claimed in claim 1 , wherein said first filter and said second filter comprise uncovered filters deposited on said circuit-receiving surface.
7. The duplexer as claimed in claim 1 , wherein said dielectric substrate comprises at least a bottom layer and a top layer, and said first filter and said second filter each comprise at least an uncovered resonator deposited on top of said top layer and a buried resonator disposed between said bottom layer and said top layer.
8. The duplexer as claimed in claim 1 , further comprising a first port matching circuit connected to said first filter and a second port matching circuit connected to said second filter.
9. The duplexer as claimed in claim 1 , wherein at least one of said first filter and said second filter comprises an hairpin filter.
10. The duplexer as claimed in claim 1 , wherein at least one of said first filter and said second filter comprises a folded half-wave resonator filter.
11. The duplexer as claimed in claim 1 , wherein said uncovered coupling circuit comprises an uncovered strip line having a substantially uniform width.
12. The duplexer as claimed in claim 11 , wherein said coupling circuit further comprises an uncovered and tapered strip line positioned between said first strip line and said second strip line.
13. A method of sharing an antenna between a receiver and a transmitter comprising:
receiving an antenna quasi-transverse electromagnetic (TEM) wave signal having a first frequency from said antenna;
propagating said antenna quasi-TEM wave signal in an electromagnetic coupling circuit;
electromagnetically coupling said antenna quasi-TEM wave signal to a first filter having a first frequency bandpass comprising said first frequency, thereby obtaining a filtered antenna signal;
propagating said filtered antenna signal to said receiver;
receiving, from said transmitter, a transmitter signal having a second frequency different from said first frequency;
propagating said transmitter signal in a second filter having a second frequency bandpass different from said first frequency bandpass and comprising said second frequency, thereby obtaining a transmitter quasi-TEM wave signal;
electromagnetically coupling said transmitter quasi-TEM wave signal to said electromagnetic coupling circuit; and
propagating said transmitter quasi-TEM wave signal to said antenna.
14. The method as claimed in claim 13 , wherein said filtered antenna signal and said transmitter signal are quasi-TEM.
15. The method as claimed in claim in claim 13 , wherein said filtered antenna signal and said transmitter signal are TEM.
16. A method of fabricating a duplexer comprising:
providing a dielectric substrate having a circuit-receiving surface and an opposite surface;
forming a ground structure on one of said circuit-receiving surface and said opposite surface;
forming, in said dielectric substrate, a first filter connectable to a first terminal and having a first frequency bandpass, and a second filter connectable to a second terminal and having a second frequency bandpass different from said first frequency bandpass, said first filter and said second filter each having at least one filter section deposited on said circuit-receiving surface; and
depositing an uncovered coupling circuit connectable to a third terminal on said circuit-receiving surface between said first filter and said second filter, the coupling circuit being spaced apart from said first and second filter by a coupling gap and configured for electromagnetically coupling said first filter and said second filter together in order to electromagnetically couple a first quasi-transverse electromagnetic (TEM) wave signal having a first frequency within said first frequency bandpass between said uncovered coupling circuit and said first filter, and a second quasi-TEM wave signal having a second frequency within said second frequency bandpass between said uncovered coupling circuit and said second filter.
17. The method as claimed in claim 16 , wherein said forming said ground structure comprises depositing a ground layer on said opposite surface.
18. The method as claimed in claim 16 , wherein said forming said ground structure comprises depositing at least one ground strip on said circuit-receiving surface.
19. The method as claimed in claim 16 , wherein said forming said first filter and said second filter comprises depositing a first uncovered filter and a second uncovered filter on said circuit-receiving surface.
20. The method as claimed in claim 16 , wherein said providing said dielectric substrate comprises providing a multilayered substrate having at least a bottom layer and a top layer, and said forming said first filter and said second filter comprises, for each one of said first filter and said second filter, depositing an uncovered resonator deposited on top of said top layer and forming a buried resonator between said bottom layer and said top layer.