Wiring board
A wiring board between which and a chip to be mounted a resin is filled includes: a substrate body on which a conductor portion to be connected to an electrode terminal of the chip is formed; and an insulating protection film formed on the substrate body and having an opening portion formed therein to expose the conductor portion. The opening portion is formed in such a manner that the edge thereof is positioned along and outside the outer shape of the chip except for a specific corner portion, and that the edge in the specific corner portion is positioned on a side of or inside the outer shape of the chip.
1. A wiring board comprising:
a wiring board and an object arranged to be mounted thereon, such that a resin is filled therebetween when the object is mounted, the object having a polygonal shape in a plan view and having a bump-shaped electrode terminal on a mounting surface side thereof, the wiring board including:
a substrate body including a conductor portion formed thereon, the conductor portion being to be connected to the electrode terminal of the object; and
an insulating protection film formed on the entire surface of the substrate body other than an opening portion and extending from a center portion of the substrate body to the edges thereof, the opening portion being formed to expose at least the conductor portion in a mounting area corresponding to an outer shape of the object,
wherein the opening portion in said insulating protection film is formed in such a manner that an outer edge thereof is positioned along and outside the mounting area of the object except for at least one corner portion of the opening portion, and said opening portion in said insulating, protection film is formed to be widely opened at other corner portions except for the at least one corner portion, and,
wherein the opening portion in said insulating protection film is formed in such a manner that the outer edge thereof in the at least one corner portion is positioned to coincide with the periphery of the mounting area of the object, or to be inside the mounting area of the object, and wherein a side surface of the insulating protection film which defines the outer edge of the opening portion in said insulating protection film, and a side surface of the object, are spaced from each other in the height direction.
2. The wiring board according to claim 1 , wherein the opening portion in said insulating protection film is formed in such a minter that the outer edge thereof in the at least one corner portion is formed in a curved manner to pass through the tip of a corner of the mounting area of the object.
3. The wiring board according to claim 1 , wherein the opening portion in said insulating protection film is formed in such a manner that the outer edge thereof in a maximum of two corner portions is positioned to coincide with the periphery of the mounting area of the object, or is positioned to be inside the mounting area of the object when an object having a rectangular shape in a plan view is mounted as the object to be mounted.
4. The wiring board according to claim 2 , wherein the opening portion in said insulating protection film is formed in such a manner that the outer edge thereof in a maximum of two corner portions is formed in a curved manner to pass through the tip of the corner of the mounting area of the object when an object having a rectangular shape in a plan view is mounted as the object to be mounted.
5. The wiring board according to claim 1 , wherein the opening portion in said insulating protection film is formed in an annular shape along the mounting area of the object.
6. The wiring board according to claim 1 , wherein the opening portion in said insulating protection film is formed to be opened all over the mounting area of the object.
7. The wiring board according to claim 1 , wherein the wiring board is adapted to mount thereon any one of a semiconductor chip, another wiring board and a semiconductor device as the object to be mounted.