Thermally conductive silicone grease composition

1. A thermally conductive silicone grease composition comprising:

(A) 100 parts by weight of an organopolysiloxane having at least two alkenyl groups in one molecule and having a kinetic viscosity of 5,000 to 100,000 mm 2 /s at 25° C.;

(B) 10 to 50 parts by weight of a hydrolyzable methylpolysiloxane having a trifunctional termination at one end and represented by the following general formula (2):

wherein R 2 represents an alkyl group having 1 to 6 carbon atoms and b is an integer of 5 to 100;

(C) 500 to 1,500 parts by weight of a thermally conductive filler having a thermal conductivity of at least 10 W/m·° C.;

(D) an organohydrogenpolysiloxane containing from 2 to 5 hydrogen atoms directly bound to silicon atoms (Si—H groups) in such an amount that the number of Si—H groups/the number of the alkenyl groups of the component (A)=1.7 to 2.8;

(E) 0.05 to 0.5 parts by weight of a bonding aid having a triazine ring and at least one alkenyl group in one molecule; and

(F) a catalyst selected from the group consisting of platinum and platinum compounds in such an amount of 0.1 to 500 ppm of a platinum atom relative to the component (A).

2. The composition according to claim 1 , further comprising 0.05 to 0.5 parts by weight, per 100 parts by weight of the component (A), of (G) an inhibiting agent selected from the group consisting of an acetylene compound, a nitrogen compound, an organophosphorus compound, an oxime compound and an organochloro compound.

3. The composition according to claim 1 or 2 , wherein when a sheet obtained by curing said composition at 150° C. for 90 minutes is measured according to a method described in JIS K6251, an elongation at breakage is at least 100% and when said composition is shaped into a 2 mm thick sheet and aged at 150° C. for 1,000 hours, an elongation at breakage is at least 80%.