Microchip and microchip manufacturing method
A microchip 1 in which a resinous film can be inhibited from sagging into a channel. The microchip 1 comprises: a resinous substrate 2 having a channel groove formed therein; and a resinous film bonded to a surface of the substrate on which the channel groove has been formed. A micro-channel 3 including channels 3 A and channels 3 B is formed by the channel groove and the resinous film 10 . The total length of the channels 3 B, which is parallel to the X direction for the resinous substrate 2 , is larger than the total length of the channels 3 A, which is parallel to the Y direction for the resinous substrate 2 . The resinous substrate 2 has been bonded to the resinous film so that the sides parallel to the channels 3 B are parallel to the TD direction of the resinous film and that the sides parallel to the channels 3 A are parallel to the MD direction of the resinous film.
1. A microchip in which a channel is formed comprising:
a resinous substrate having a substantially rectangular outer shape in which a channel groove is formed, and
a resinous film to form the channel by being bonded onto a surface of the resinous substrate on which the channel groove is formed,
wherein a total length of a first channel parallel to a first side of the resinous substrate is longer than a total length of a second channel parallel to a second side, perpendicular to the first side, of the resinous substrate, and the resinous substrate and the resinous film are bonded in a way that the first side and a TD direction of the resinous film are parallel and the second side and a MD direction of the resinous film are parallel.
2. A microchip in which a channel is formed comprising:
a resinous substrate in which a channel groove is formed, and
a resinous film to form the channel by being bonded onto a surface of the resinous substrate on which the channel groove is formed,
wherein when the channel is disaggregated into a first channel representing an element parallel to a first side of a virtual rectangle surrounding the resinous substrate defined to be in contact with a periphery of the resinous substrate and a second channel representing an element parallel to a second channel perpendicular to the first side, a total length of the first channel is longer than a total length of the second channel, wherein the resinous substrate and the resinous film are bonded in a way that the first side and a TD direction of the resinous film are parallel and the second side and a MD direction of the resinous film are parallel.
3. The microchip of claim 1 , wherein the total length of the first channel is more than two times of the total length of the second channel,
4. A manufacturing method of a microchip having a channel, comprising:
bonding a resinous film via thermal fusion bonding onto a surface of a resinous substrate on which a channel groove is formed, wherein the resinous substrate in which the channel groove is formed, is in a substantially rectangular shape,
wherein a total of a length of a first channel parallel to a first side of the resinous substrate is longer than a total of a length of a second channel parallel to a second side, perpendicular to the first side, of the resinous substrate, and the resinous substrate and the resinous film are bonded in a way that the first side and a TD direction of the resinous film are parallel and the second side and a MD direction of the resinous film are parallel.
5. A manufacturing method of a microchip having a channel, comprising:
bonding a resinous film via thermal fusion bonding onto a surface of a resinous substrate on which a channel groove is formed, wherein the channel groove is formed in the resinous substrate,
wherein when the channel is disaggregated into a first channel representing an element parallel to a first side of a virtual rectangle surrounding the resinous substrate defined to be in contact with a periphery of the resinous substrate and a second channel representing an element parallel to a second channel perpendicular to the first side, a total length of the first channel is longer than a total length of the second channel, wherein the resinous substrate and the resinous film are bonded in a way that the first side and a TD direction of the resinous film are parallel and the second side and a MD direction of the resinous film are parallel.
6. The manufacturing method of the microchip of claim 4 , wherein the total length of the first channel is more than two times of the total length of the second channel.
7. The manufacturing method of the microchip of claim 4 , wherein a sagging amount of the resinous film in a cross-section in a width direction of the first channel is smaller that a sagging amount of the resinous film in a cross-section in a width direction of the second channel.
8. The manufacturing method of the microchip of claim 4 , wherein a sagging angle of the resinous film in a cross-section in a width direction of the first channel is smaller that a sagging angle of the resinous film in a cross-section in a width direction of the second channel.
9. The manufacturing method of the microchip of claim 4 , wherein the bonded resinous substrate and the resinous film is subject to annealing at a predetermined temperature.