IP Library › Granted Patent US 8,391,538
Granted Patent B2
US 8,391,538 · App. 12/973,876 · Granted Mar 5, 2013

Earphone

Inventors: Chun-Ching Chiu (Taipei, TW); Mu-Tsun Tseng (Taipei, TW)
Assignee: Cheng Uei Precision Industry Co., Ltd.
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Quick Facts
Patent No.
US 8,391,538
App. No.
12/973,876
Granted
Mar 5, 2013
Kind
B2
Abstract

An earphone includes a basket defining a through hole. A leading wire board fixed underneath the basket has a pair of solder foils on a bottom surface thereof. A magnet unit is located in the basket with the through hole adjacent to a side edge of the magnet unit. A diaphragm is arranged on the basket and over the magnet unit. A voice coil is fixed to a bottom of the diaphragm and surrounding the magnet unit. The voice coil has two leading wires. Each leading wire passes through the through hole of the basket and further bends to solder with the corresponding solder foils of the leading wire board.

Claims (7)

1. An earphone, comprising:

a basket having a main body with a center of the main body defining an opening and a periphery of the opening extended downward to form an annular side wall, and a bottom board connecting with a bottom of the annular side wall to collectively define a receiving room, a portion of the bottom board adjacent to the annular side wall defining a through hole;

a leading wire board fixed underneath the bottom board of the basket having a pair of solder foils on a bottom surface thereof and an aperture defined in a side edge of the leading wire board corresponding to the through hole of the basket;

a magnet unit located in the basket and received in the receiving room with the through hole of the basket adjacent to a side edge of the magnet unit;

a diaphragm received by the main body of the basket over the magnet unit; and

a voice coil fixed to a bottom of the diaphragm and surrounding the magnet unit, the voice coil having two leading wires corresponding to the two solder foils, each leading wire passing through the through hole of the basket and the aperture of the leading wire board and further being bent to solder with the corresponding solder foil of the leading wire board.

2. The earphone claimed in claim 1 , wherein the magnet unit includes a magnet and a magnetic conduction plate attached on the magnet.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 20, 2010
From: CHIU, CHUN-CHING; TSENG, MU-TSUN
To: CHENG UEI PRECISION INDUSTRY CO., LTD.
Reel/Frame 025532/0404 →
Continuity (1)
Related Publication 20120155690A1 · Jun 21, 2012