LED illumination apparatus
The present invention is directed to a light-emitting diode (LED) illumination apparatus. The apparatus includes a housing, an LED substrate, at least two electrical-insulation clamping members and associated screws, and a heat-conduction pad. At least one LED chip is fixed on the surface of the LED substrate. Each electrical-insulation clamping member has a threaded hole for screwing the screw in order to fasten the electrical-insulation clamping member to the housing; and each electrical-insulation clamping member has a recess for clamping the LED substrate. The heat-conduction pad is disposed between the housing and the LED substrate, and is used to conduct heat generated by the LED chip.
1. A light-emitting diode (LED) illumination apparatus, comprising:
a housing;
an LED substrate with at least one LED chip fixed thereon;
at least two electrical-insulation clamping members and associated screws, each said electrical-insulation clamping member having a threaded hole for screwing the screw to fasten the electrical-insulation clamping to the housing, wherein each said electrical-insulation clamping member is formed integrally and has a recess for clamping a periphery of the LED substrate and the recess of the electrical-insulation clamping member has a direction perpendicular to a direction of the threaded hole; and
a heat-conduction pad disposed between the housing and the LED substrate and used to conduct heat generated by the LED chip.
2. The apparatus of claim 1 , further comprising a heat-conduction insulation sheet disposed between the LED substrate and the heat-conduction pad.
3. The apparatus of claim 2 , wherein the heat-conduction insulation sheet is clamped by the electrical-insulation clamping members.
4. The apparatus of claim 2 , wherein at least one end of the heat-conduction insulation sheet is fastened between the electrical-insulation clamping member and the housing by exertion force of the electrical-insulation clamping member and the screw.
5. The apparatus of claim 1 , further comprising a heat-conduction insulation sheet disposed between the heat-conduction pad and the housing.
6. The apparatus of claim 5 , at least one end of the heat-conduction insulation sheet is fastened between the electrical-insulation clamping member and the housing by exertion force of the electrical-insulation clamping member and the screw.
7. The apparatus of claim 5 , further comprising an additional heat-conduction insulation sheet disposed between the LED substrate and the heat-conduction pad.
8. The apparatus of claim 7 , wherein the additional heat-conduction insulation sheet is clamped by the electrical-insulation clamping members.
9. The apparatus of claim 1 , wherein the electrical-insulation clamping member is made of plastic material.
10. The apparatus of claim 1 , wherein the electrical-insulation clamping member is double-layer cylinders in shape.
11. The apparatus of claim 1 , wherein the heat-conduction pad is integrated with the housing.
12. The apparatus of claim 1 , wherein the heat-conduction pad is made of aluminum material.
13. The apparatus of claim 1 , wherein the LED substrate is an aluminum substrate, a ceramic substrate or a copper substrate.
14. The apparatus of claim 1 , wherein the LED substrate comprises a circuit wiring layer and a heat-conduction layer, wherein the LED chip is fixed on the circuit wiring layer.
15. The apparatus of claim 14 , wherein the LED chip to be fixed is in a module or a package.
16. The apparatus of claim 15 , wherein the package of the LED chip is a surface-mounted device (SMD) package or a pin through hole (PTH) package.
17. The apparatus of claim 14 , further comprising a high-voltage insulation layer disposed between the circuit wiring layer and the heat-conduction layer.
18. The apparatus of claim 1 , wherein the housing comprises a bottom housing, a top housing and an electrode contact part in order, wherein the electrical-insulation clamping member is fixed on the bottom housing.
19. The apparatus of claim 18 , further comprising a power supply disposed in a space defined by the bottom housing and the top housing.
20. The apparatus of claim 1 , further comprising a lamp cover to cover the LED substrate, the electrical-insulation clamping member, the screw and the heat-conduction pad.