Multilayer coil component
A multilayer coil component is provided to have high reliability and in which internal stress arising from the difference in firing shrinkage behavior and/or thermal expansion coefficient between ferrite layers and internal conductor layers is alleviated without forming conventional voids between the ferrite layers and the internal conductor layers. A method of manufacturing a multilayer coil includes a step of isolating interfaces between internal conductors and surrounding ferrite by allowing a complexing agent solution to reach interfaces between the internal conductors and the surrounding ferrite through side gap portions from side surfaces of a ferrite element including a helical coil. The complexing agent solution contains at least one selected from the group consisting of an aminocarboxylic acid, a salt of the aminocarboxylic acid, an oxycarboxylic acid, a salt of the oxycarboxylic acid, an amine, phosphoric acid, a salt of phosphoric acid, and a lactone compound.
1. A multilayer coil component comprising:
a laminate including:
stacked ferrite layers made of ferrite and containing Cu; and
a helical coil formed by interlayer-connecting internal conductors made of Ag, wherein
the internal conductors are surrounded by the ferrite,
the multilayer coil component is formed by calcining the laminate,
no voids are present at interfaces between the internal conductors and the surrounding ferrite,
the interfaces between the internal conductors and the surrounding ferrite are isolated, and
the segregation coefficient of Cu at the interfaces between the internal conductors and the surrounding ferrite is 5% or less.
2. The multilayer coil component according to claim 1 , wherein a pore area fraction of ferrite contained in side gap portions of a ferrite is within the range of 6% to 20%, the side gap portions being areas between side portions of the internal conductors and side surfaces of the ferrite.
3. The multilayer coil component of according to claim 1 , wherein the segregation coefficient of Cu at the interfaces between the internal conductors and the surrounding ferrite is 3% or less.