IP Library Granted Patent US 8,428,281
Granted Patent B2
US 8,428,281 · App. 12/985,800 · Granted Apr 23, 2013

Small hearing aid

Inventors: Jong-keun Song (Yongin-si, KR); Dong-wook Kim (Seoul, KR); Yoon-seo Koo (Seoul, KR)
Assignee: Samsung Electronics Co., Ltd.
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Quick Facts
Patent No.
US 8,428,281
App. No.
12/985,800
Granted
Apr 23, 2013
Kind
B2
Abstract

A hearing aid comprises a microelectromechanical systems microphone which receives inputs of external sound signals, converting the sound signals to analog signals, and outputting the analog signals; a hearing aid processor chip which converts the analog signals to digital signals, performs gain correction and digital signal processing to the digital signals, and converts the processed digital signals to analog signals; and a microelectromechanical system receiver which outputs the analog signals converted from the processed digital signals as sound signals, wherein the microelectromechanical system microphone is attached to a first surface of the hearing aid processor chip, and the microelectromechanical system receiver is attached to a second surface of the hearing aid processor chip, so that the microelectromechanical system microphone, the hearing aid processor chip, and the microelectromechanical system receiver are integrated as a single body.

Claims (85)

1. A hearing aid comprising:

a microelectromechanical system microphone which receives inputs of external sound signals, converting the sound signals to analog signals, and outputting the analog signals;

a hearing aid processor chip which converts the analog signals to digital signals, performs gain correction and digital signal processing to the digital signals, and converts the processed digital signals to analog signals; and

a microelectromechanical system receiver which outputs the analog signals converted from the processed digital signals as sound signals,

wherein the microelectromechanical system microphone is disposed to a first surface of the hearing aid processor chip, and

the microelectromechanical system receiver is disposed to a second surface of the hearing aid processor chip, so that the microelectromechanical system microphone, the hearing aid processor chip, and the microelectromechanical system receiver are integrated as a single body.

2. The hearing aid of claim 1 , wherein the hearing aid processor chip further comprises:

a preamplifier which amplifies the analog signals output by the microelectromechanical system microphone;

an analog-to-digital converter which converts the analog signals amplified by the preamplifier to digital signals;

a signal processor which performs gain correction and digital signal processing with respect to the digital signals converted from the analog signals by the analog-to-digital converter;

a digital-to-analog converter which converts the digital signals processed by the signal processor to analog signals; and

an amplifier which amplifies the analog signals converted from the digital signals by the digital-to-analog converter.

3. The hearing aid of claim 1 , wherein each of the microelectromechanical system microphone and the microelectromechanical system receiver further comprises a plurality of transducer cells, each of the plurality of transducer cells comprises:

a substrate;

a first electrode disposed on the substrate;

a plurality of supporting units disposed on the first electrode;

a thin film supported by the plurality of supporting units; and

a second electrode disposed on the thin film.

4. The hearing aid of claim 3 , wherein the plurality of transducer cells is arranged in an array.

5. The hearing aid of claim 3 , wherein a frequency band of the plurality of transducer cells is an audible frequency band, that is, from about 20 hertz to about 20,000 hertz.

6. The hearing aid of claim 1 , further comprising:

a housing which surrounds the hearing aid; and

a plurality of fixing units disposed to outer surfaces of the housing.

7. A hearing aid comprising:

a printed circuit board in which a groove is formed;

a microelectromechanical system microphone which receives inputs of external sound signals, converts the sound signals to analog signals, and outputs the analog signals;

a hearing aid processor chip which converts the analog signals to digital signals, performs gain correction and digital signal processing to the digital signals, and converts the processed digital signals to analog signals; and

a microelectromechanical system receiver which outputs the analog signals converted from the processed digital signals as sound signals,

wherein the hearing aid processor chip is disposed to the bottom surface of the groove formed in the printed circuit board;

the microelectromechanical system microphone is disposed to a first surface of the printed circuit board, and

the microelectromechanical system receiver is disposed to a second surface of the printed circuit board, so that the microelectromechanical system microphone, the hearing aid processor chip, the printed circuit board, and the microelectromechanical system receiver are integrated as a single body.

8. The hearing aid of claim 7 , wherein each of the microelectromechanical system microphone and the microelectromechanical system receiver comprises a plurality of transducer cells, each of which comprises:

a substrate;

a first electrode disposed on the substrate;

a plurality of supporting units disposed on the first electrode;

a thin film supported by the plurality of supporting units; and

a second electrode disposed on the thin film.

9. The hearing aid of claim 8 , wherein the plurality of transducer cells is arranged in an array.

10. The hearing aid of claim 8 , wherein a frequency band of the plurality of transducer cells is an audible frequency band, that is, from about 20 hertz to about 20,000 hertz.

11. A hearing aid comprising:

a printed circuit board;

a microelectromechanical system microphone chip, which is disposed on a first surface of the printed circuit board, receives inputs of external sound signals, converts the sound signals to analog signals, and outputs the analog signals;

a hearing aid processor chip, which is disposed on the first surface of the printed circuit board, converts the analog signals to digital signals, performs gain correction and digital signal processing to the digital signals, and converts the processed digital signals to analog signals; and

a microelectromechanical system receiver chip, which is disposed on a second surface of the printed circuit board and outputs the analog signals converted from the processed digital signals as sound signals,

wherein the microelectromechanical system microphone chip, the hearing aid processor chip, and the microelectromechanical system receiver chip are disposed on the single printed circuit board.

12. The hearing aid of claim 11 , wherein the hearing aid processor chip comprises:

a preamplifier which amplifies the analog signals output by the microelectromechanical system microphone chip;

an analog-to-digital converter which converts the analog signals amplified by the preamplifier to digital signals;

a signal processor which performs gain correction and digital signal processing to the digital signals with respect to the digital signals converted from the analog signals by the analog-to-digital converter;

a digital-to-analog converter which converts the digital signals processed by the signal processor to analog signals; and

an amplifier which amplifies the analog signals converted from the digital signals by the digital-to-analog converter.

13. The hearing aid of claim 11 , wherein each of the microelectromechanical system microphone chip and the microelectromechanical system receiver chip comprises a plurality of transducer cells, each of which comprises:

a substrate;

a first electrode disposed on the substrate;

a plurality of supporting units disposed on the first electrode;

a thin film supported by the plurality of supporting units; and

a second electrode disposed on the thin film.

14. The hearing aid of claim 13 , wherein the plurality of transducer cells is arranged in an array.

15. The hearing aid of claim 13 , wherein a frequency band of the plurality of transducer cells is an audible frequency band, that is, from about 20 hertz to about 20,000 hertz.

16. The hearing aid of one of claims 11 through 14 , further comprising:

a housing which surrounds the hearing aid; and

a plurality of fixing units disposed to outer surfaces of the housing.

17. A hearing aid comprising:

a substrate;

a microelectromechanical system microphone, which is disposed on a first surface of the substrate, receives inputs of external sound signals, converts the sound signals to analog signals, and outputs the analog signals;

a hearing aid processor chip, which is disposed on the first surface of the substrate, converts the analog signals to digital signals, performs gain correction and digital signal processing to the digital signals, and converts the processed digital signals to analog signals; and

a microelectromechanical system receiver, which is disposed on a second surface of the substrate and outputs the analog signals converted from the processed digital signals as sound signals,

wherein the microelectromechanical system microphone, the hearing aid processor chip, and the microelectromechanical system receiver are disposed on the single substrate.

18. The hearing aid of claim 17 , wherein the hearing aid processor chip comprises:

a preamplifier which amplifies the analog signals output by the microelectromechanical system microphone;

an analog-to-digital converter which converts the analog signals amplified by the preamplifier to digital signals;

a signal processor which performs gain correction and digital signal processing to the digital signals with respect to the digital signals converted from the analog signals by the analog-to-digital converter;

a digital-to-analog converter which converts the digital signals processed by the signal processor to analog signals; and

an amplifier which amplifies the analog signals converted from the digital signals by the digital-to-analog converter.

19. The hearing aid of claim 17 , wherein each of the microelectromechanical system microphone and the microelectromechanical system receiver comprises a plurality of transducer cells, each of which comprises:

a substrate;

a first electrode disposed on the substrate;

a plurality of supporting units disposed on the first electrode;

a thin film supported by the plurality of supporting units; and

a second electrode disposed on the thin film.

20. The hearing aid of claim 19 , wherein the plurality of transducer cells is arranged in an array.

21. The hearing aid of claim 19 , wherein a frequency band of the plurality of transducer cells is an audible frequency band, that is, from about 20 hertz to about 20,000 hertz.

22. The hearing aid of claim 17 , further comprising:

a housing surrounding the hearing aid; and

a plurality of fixing units disposed to outer surfaces of the housing.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 10, 2011
From: SONG, JONG-KEUN; KIM, DONG-WOOK; KOO, YOON-SEO
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 025605/0170 →
Priority Claims (1)
KR 10-2010-0009161 · Feb 1, 2010 · national
Continuity (1)
Related Publication 20110188687A1 · Aug 4, 2011