Chemical-mechanical planarization pad
The present disclosure relates to a polishing pad. The polishing pad may include a polymer layer having a three-dimensional network therein and a composite layer having the ability to equalize pressure across the pad surface, including a first adhesive wherein the composite exhibits a hydrostatic modulus of 1 to 500 psi when compressed at a pressure of 1 to 50 psi.
1. A polishing pad, comprising:
a polymer layer including a three-dimensional network; and
a pressure equalizing composite layer consisting of a sheet including a first side a second side opposite said first side; a first adhesive layer disposed on the entirety of said first side and a second adhesive layer of a second adhesive disposed on said second side of the sheet to equalize pressure across the pad surface and to provide a hydrostatic modulus of 1 to 500 psi when compressed at a pressure of 1 to 50 psi.
2. The polishing pad of claim 1 , wherein said three-dimensional network is at least partially porous.
3. The polishing pad of claim 1 , wherein said adhesive layer is acrylic based.
4. The polishing pad of claim 1 , wherein said polymer layer includes a binder material having a first hardness H 1 and said three-dimensional network exhibits a second hardness H 2 , wherein H 1 > H 2 .
5. The polishing pad of claim 1 , wherein said first adhesive exhibits a first 180 degree peel strength PS 1 and said second adhesive exhibits a second 180 degree peel strength PS 2 , wherein PS 1 >PS 2 .
6. The polishing pad of claim 1 , wherein said first adhesive is acrylic based and said second adhesive is a diene type polymer, wherein said first adhesive is affixed to said polymer layer.
7. A method of affixing a polishing pad to a tool, comprising:
providing a polishing pad comprising a polymer layer including a three-dimensional network, and a pressure equalizing composite layer consisting of a sheet including a first side a second side opposite said first side, a first adhesive layer disposed on the entirety of said first side and a second adhesive layer of a second adhesive disposed on said second side of the sheet to equalize pressure across the pad surface and to provide a hydrostatic modulus of 1 to 500 psi when compressed at a pressure of 1 to 50 psi; and
adhering a polishing pad to a tool.
8. The method of claim 7 , wherein said adhesive layer is acrylic based.
9. The method of claim 7 , wherein said polymer layer includes a binder material having a first hardness H 1 and said three-dimensional network exhibits a second hardness H 2 , wherein H 1 > H 2 .
10. The method of claim 7 , wherein said first adhesive exhibits a first 180 degree peel strength PS 1 , and said second adhesive exhibits a second 180 degree peel strength PS 2 , wherein PS 1>PS 2 .
11. The method of claim 7 , wherein said first adhesive is acrylic based and said second adhesive is a diene type polymer.
12. A method of forming a polishing pad comprising:
providing a polymer layer including a three-dimensional network; and
adhering a pressure equalizing composite layer consisting of a sheet including a first side a second side opposite said first side; a first adhesive layer disposed on the entirety of said first side and a second adhesive layer of a second adhesive disposed on said second side of the sheet to equalize pressure across the pad surface and to provide a hydrostatic modulus of 1 to 500 psi when compressed at a pressure of 1 to 50psi.
13. The method of claim 12 , wherein said adhesive layer is acrylic based.
14. The method of claim 12 , wherein said polymer layer includes a binder material having a first hardness H 1 and said three-dimensional network exhibits a second hardness H 2 , wherein H 1 >H 2 .
15. The method of claim 12 , wherein said first adhesive exhibits a first 180 degree peel strength PS 1 and said second adhesive exhibits a second 180 degree peel strength PS 2 , wherein PS 1 >PS 2 .
16. The method of claim 12 , wherein said first adhesive is acrylic based and said second adhesive is a diene type polymer.