Spacer and process to enhance the strain in the channel with stress liner
Process for enhancing strain in a channel with a stress liner, spacer, process for forming integrated circuit and integrated circuit. A first spacer composed of an first oxide and first nitride layer is applied to a gate electrode on a substrate, and a second spacer composed of a second oxide and second nitride layer is applied. Deep implanting of source and drain in the substrate occurs, and removal of the second nitride, second oxide, and first nitride layers.
1. A process for enhancing strain in a channel with a stress liner, comprising:
applying a first spacer composed of an first oxide and first nitride layer to a gate electrode on a substrate;
applying a second spacer composed of a second oxide and second nitride layer;
performing an extension/halo implantation before the applying of the second spacer;
deep implanting source and drain in the substrate;
removing the second nitride, second oxide, and first nitride layers to form an L-shaped oxide spacer adjacent the gate electrode; and
depositing a stress contact liner over the gate and the L-shaped spacer.
2. The process in accordance with claim 1 , wherein the gate electrode is formed by a poly gate etch.
3. The process in accordance with claim 1 , wherein the first oxide layer is formed by gate reoxidation.
4. The process in accordance with claim 3 , wherein the first oxide layer has a thickness of 1-5 nm.
5. The process in accordance with claim 1 , wherein the first nitride layer has a thickness of 10-15 nm.
6. The process in accordance with claim 1 , further comprising forming silicide on the gate electrode and a source/drain region before the removal of the first and second nitride layers and the second oxide layer.
7. The process in accordance with claim 1 , further comprising forming silicide on the gate electrode and a source/drain region after the removal of the first and second nitride layers and the second oxide layer.
8. The process in accordance with claim 1 , wherein the removing of the first and second nitride layers and the second oxide layer comprises one of a wet etch or a reactive ion etch.
9. A process for forming an integrated circuit, comprising:
forming a gate electrode on a substrate;
forming an L-shaped oxide spacer adjacent the gate electrode; and
depositing a stress liner over the gate electrode and the L-shaped spacer
wherein the forming of the L-shaped spacer comprises forming a first oxide/nitride spacer, performing an extension/halo implantation, forming a second oxide/nitride spacer, and removing the second oxide/nitride spacer and the nitride of the first oxide/nitride spacer.
10. The process in accordance with claim 9 , wherein a vertical extent of the L-shaped oxide spacer has a thickness between 1-5 nm.
11. The process in accordance with claim 9 , wherein the first oxide layer is formed over the gate electrode by reoxidation, the first nitride layer is deposited over the oxide layer, the second oxide layer is deposited over the first nitride layer, after the extension/halo implantation, and the second nitride layer is depositing over the second oxide layer.
12. The process in accordance with claim 11 , wherein prior to removing the second oxide and the first and second nitride layers, the process further comprises deep implanting source and drain in the substrate.
13. The process in accordance with claim 11 , further comprising forming silicide after the removal of the first and second nitride layers and the second oxide layer.
14. The process in accordance with claim 11 , further comprising forming silicide before the removal of the first and second nitride layers and the second oxide layer.
15. The process in accordance with claim 11 , wherein the removing of the first and second nitride layers and the second oxide layer comprises one of a wet etch or a reactive ion etch.
16. The process in accordance with claim 9 , wherein the gate electrode is formed by a poly gate etch.