Heat sink with surface-formed vapor chamber base

1. A heat sink comprising:

a vapor chamber base formed in a three-dimensional arrangement that mirrors topology of underlying structures on a substrate upon which the heat sink can be mounted, the vapor chamber base formed with a surface that encases sides and top of integrated circuits to maintain a uniform base temperature raised to extend over obstructions on the substrate; and

at least one fin coupled to the vapor chamber base.

2. The heat sink according to claim 1 further comprising:

the vapor chamber base three-dimensional arrangement configured to maintain a controlled distance between an outer edge of the vapor chamber base and the underlying topology.

3. The heat sink according to claim 1 further comprising:

the vapor chamber base three-dimensional arrangement configured to extend over obstructions while maintaining a uniform base temperature and reducing or minimizing conduction losses.

4. The heat sink according to claim 1 further comprising:

a plurality of fins bonded directly to the vapor chamber base.

5. The heat sink according to claim 1 further comprising:

the vapor chamber base formed with a thickness sufficient to rise above and clear obstructions on the underlying topology.

6. The heat sink according to claim 1 further comprising:

the vapor chamber base formed with a thickness sufficient to raise above and clear obstructions on the underlying topology and extending to a planar surface opposite the underlying topology; and

a plurality of fins coupled to the planar surface.

7. The heat sink according to claim 1 further comprising:

the vapor chamber base further comprising:

a shell formed in a three-dimensional arrangement that mirrors topology of underlying structures and has thickness sufficient to raise above and clear obstructions on the underlying topology; and

a planar lid configured for coupling to the shell.

8. The heat sink according to claim 7 further comprising:

the shell configured with a relatively small planar area at a surface for mounting adjacent the underlying structures and expanding laterally as distance from the underlying structures increases.

9. The heat sink according to claim 7 further comprising:

the shell configured with an interior cavity that forms a chamber within the vapor chamber base;

the planar lid configured for attachment to the shell whereby the chamber is a sealed, inner vapor chamber;

a wicking material for placement in the vapor chamber to enable fluid transport from the lid to a heat source; and

fluid for injection into the vapor chamber.

10. The heat sink according to claim 9 further comprising:

a support structure formed in the chamber configured to increase strength and facilitate fluid transport of the vapor chamber base.

11. A method for constructing a heat sink comprising:

determining a topology of a substrate and components mounted on the substrate;

forming a vapor chamber base in a three-dimensional arrangement that mirrors the topology, the vapor chamber base formed with a surface that encases sides and top of integrated circuits to maintain a uniform base temperature raised to extend over obstructions on the substrate; and

coupling at least one fin to the vapor chamber base.

12. The method according to claim 11 further comprising:

forming the vapor chamber base three-dimensional arrangement to extend over obstructions while maintaining a uniform base temperature and reducing or minimizing conduction losses.

13. The method according to claim 11 further comprising:

bonding a plurality of fins directly to the vapor chamber base.

14. The method according to claim 11 further comprising:

forming the vapor chamber base with a thickness sufficient to rise above and clear obstructions on the underlying topology and extend to a planar surface opposite the underlying topology.

15. The method according to claim 11 further comprising:

forming a shell formed in a three-dimensional arrangement that mirrors topology of underlying structures and having thickness sufficient to raise above and clear obstructions on the underlying topology;

forming a planar lid in a configuration for coupling to the shell.

16. The method according to claim 15 further comprising:

forming the shell with a relatively small planar area at a surface for mounting adjacent the underlying structures and expanding laterally as distance from the underlying structures increases.

17. The method according to claim 15 further comprising:

forming the shell with an interior cavity that forms a chamber within the vapor chamber base;

forming a support structure in the chamber in a configuration that increases strength and facilitates fluid transport of the vapor chamber base;

forming the planar lid for attachment to the shell whereby the chamber is a sealed, inner vapor chamber;

placing a wicking material in the vapor chamber for fluid transport from the lid to a heat source; and

injecting fluid into the vapor chamber.

18. An electronic system comprising:

an electronic assembly comprising a substrate and at least one component mounted on the substrate; and

a heat sink configured for mounting on the electronic assembly comprising:

a vapor chamber base formed in a three-dimensional arrangement that mirrors topology of components on the substrate upon which the heat sink is mounted, the vapor chamber base formed with a surface that encases sides and top of integrated circuits to maintain a uniform base temperature raised to extend over obstructions on the substrate; and

at least one fin coupled to the vapor chamber base.

19. The electronic system according to claim 18 further comprising:

a plurality of fins bonded directly to the vapor chamber base.

20. The electronic system according to claim 18 further comprising:

the vapor chamber base further comprising:

a shell formed in a three-dimensional arrangement that mirrors topology of underlying structures and has thickness sufficient to raise above and clear obstructions on the underlying topology, the shell configured with a relatively small planar area at a surface for mounting adjacent the underlying structures and expanding laterally as distance from the underlying structures increases, the shell configured with an interior cavity that forms a chamber within the vapor chamber base;

a support structure formed in the chamber configured to increase strength and facilitate fluid transport of the vapor chamber base;

a planar lid configured for attachment to the shell whereby the chamber is a sealed, inner vapor chamber;

a wicking material for placement in the vapor chamber to enable fluid transport from the lid to a heat source; and

fluid for injection into the vapor chamber.