IP Library › Granted Patent US 8,464,589
Granted Patent B2
US 8,464,589 · App. 12/904,169 · Granted Jun 18, 2013

Micro-electromechanical systems (MEMS) structure

Inventors: Chien-Hsing Lee (Hsinchu County, TW); Tsung-Min Hsieh (Taipei County, TW); Li-Chi Tsao (Taichung, TW); Jhyy-Cheng Liou (Hsinchu County, TW)
Assignee: Solid State System Co., Ltd.
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,464,589
App. No.
12/904,169
Granted
Jun 18, 2013
Kind
B2
Abstract

A MEMS structure includes a substrate, a structural dielectric layer, and a diaphragm. A structural dielectric layer is disposed over the substrate. The diaphragm is held by the structural dielectric layer at a peripheral end. The diaphragm includes multiple trench/ridge rings at a peripheral region surrounding a central region of the diaphragm. A corrugated structure is located at the central region of the diaphragm, surrounded by the trench/indent rings.

Claims (30)

1. A micro-electromechanical systems (MEMS) structure, comprising:

a substrate, having a front side and a back side, wherein the substrate have a predeteimined region;

a structural dielectric layer, disposed over the front side of the substrate;

a diaphragm, held by the structural dielectric layer at a peripheral end, wherein the diaphragm is above the substrate corresponding to the predeteimined region and forms a chamber between the substrate and the diaphragm, the chamber is connected to an outer space by multiple through holes in the substrate or in a structure layer on the front side of the substrate, or in both the substrate and the structure layer,

wherein the diaphragm comprises:

a plurality of trench/ridge rings at a peripheral region surrounding a central region of the diaphragm; and

a corrugated structure, located at the central region of the diaphragm, surrounded by the trench/ridge rings.

2. The MEMS structure of claim 1 , wherein the trench/ridge rings are discontinuous, each of the trench/ridge rings being discontinuous is formed by a plurality of trench/ridge segments.

3. The MEMS structure of claim 2 , wherein multiple gaps between the trench/ridge segments in each of the trench/ridge rings are blocked by the trench/ridge segments of at least another one of the discontinuous trenches in a radiant direction from a center.

4. The MEMS structure of claim 3 , wherein the corrugated structure of the diaphragm comprises a plurality of indent/protruding units, arranged in a honey-comb-like geometric structure.

5. The MEMS structure of claim 4 , wherein each of the indent/protruding units comprises an enclosed ring of trench/ridge to surround an inner region.

6. The MEMS structure of claim 5 , wherein the enclosed ring of trench/ridge in geometric shape is polygon, circular or hexagonal.

7. The MEMS structure of claim 4 , wherein each of the indent/protruding units comprises an enclosed ring of trench/ridge to surround an inner region and a center trench/ridge within the inner region.

8. The MEMS structure of claim 7 , wherein the enclosed ring of trench/ridge in geometric shape is polygon, circular or hexagonal.

9. The MEMS structure of claim 2 , wherein multiple gaps between the trench/ridge segments in each of the trench/ridge rings are aligned to form a radiant gap line.

10. The MEMS structure of claim 9 , wherein the corrugated structure of the diaphragm comprises a plurality of indent/protruding units, arranged in a honey-comb-like geometric structure.

11. The MEMS structure of claim 10 , wherein each of the indent/protruding units comprises an enclosed trench/ridge to surround an inner region.

12. The MEMS structure of claim 11 , wherein the enclosed trench/ridge in geometric shape is polygon, circular or hexagonal.

13. The MEMS structure of claim 10 , wherein each of the indent/protruding units comprises an enclosed trench/ridge to surround an inner region and a center trench/ridge in the inner region.

14. The MEMS structure of claim 13 , wherein the enclosed trench/ridge in geometric shape is polygon, circular or hexagonal.

15. The MEMS structure of claim 1 , wherein the trench/ridge rings include at least one being discontinuous and formed by a plurality of trench/ridge segments and at least one continuous ring.

16. The MEMS structure of claim 1 , wherein the diaphragm is a single layer formed by a single material.

17. The MEMS structure of claim 1 , wherein the diaphragm is a stacked layer.

18. The MEMS structure of claim 1 , wherein the diaphragm has a stacked portion just at the trench/ridge rings.

19. The MEMS structure of claim 1 , wherein the corrugated structure of the diaphragm comprises a plurality of indent/protruding units, arranged in a honey-comb-like geometric structure.

20. A micro-electromechanical systems (MEMS) structure, comprising:

a substrate, having a front side and a back side, wherein the substrate have a predetermined region;

a structural dielectric layer, disposed over the front side of the substrate;

a diaphragm, held by the structural dielectric layer at a peripheral end, wherein the diaphragm is above the substrate corresponding to the predetermined region and forms a chamber between the substrate and the diaphragm, the chamber is connected to an outer space by multiple through venting holes in the substrate or in a structure layer on the front side of the substrate, or in both the substrate and the structure layer,

wherein the diaphragm comprises a plurality of trench/ridge rings at a peripheral region surrounding a central region of the diaphragm, and each of the trench/ridge rings is discontinuous and formed by a plurality of trench/ridge segments.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 15, 2010
From: LEE, CHIEN-HSING; HSIEH, TSUNG-MIN; TSAO, LI-CHI; LIOU, JHYY-CHENG
To: SOLID STATE SYSTEM CO., LTD.
Reel/Frame 025142/0815 →
Continuity (1)
Related Publication 20120090398A1 · Apr 19, 2012