Integrated array transmit/receive module
Disclosed are integration approaches for mm-wave array type architectures using multilayer substrate technologies. For instance, an apparatus may include a first substrate layer, a second substrate layer, and a third substrate layer. The first substrate layer has a first plurality of array elements, and the second substrate layer has a second plurality of array elements. The third substrate layer has an integrated circuit to exchange one or more radio frequency (RF) signals with the first and second pluralities of array elements. The first and second substrate layers are separated by approximately a half wavelength (λ/2) corresponding to the one or more RF signals.
1. An apparatus, comprising:
one or more first substrate layers having a first plurality of array elements;
one or more second substrate layers having a second plurality of array elements;
a third substrate layer;
an integrated circuit on the third substrate layer, the integrated circuit to exchange one or more radio frequency (RF) signals with the first and second pluralities of array elements; and
a connector module to exchange one or more further signals between the integrated circuit and a host module, the one or more further signals corresponding to the one or more RF signals;
wherein the first and second substrate layers are separated by approximately a half wavelength (λ/2) corresponding to the one or more RF signals.
2. The apparatus of claim 1 , wherein the one or more RF signals are each millimeter-wave signals.
3. The apparatus of claim 1 , wherein the connector module is configured to receive a flexible cable having one or more conductors, the flexible cable to convey the one or more further signals.
4. The apparatus of claim 1 , wherein the third substrate layer is between the first and second substrate layers.
5. The apparatus of claim 1 , further comprising a printed circuit board to exchange one or more further signals with the integrated circuit, the one or more further signals corresponding to the one or more RF signals.
6. The apparatus of claim 1 , wherein the first and second pluralities of array elements includes pairs of corresponding array elements, each pair including a first array element from the first plurality and a second array element from the second plurality.
7. The apparatus of claim 1 , wherein each of the pairs of corresponding array elements are in alignment.
8. The apparatus of claim 1 , further comprising one or more slots arranged between the pairs of corresponding array elements.
9. The apparatus of claim 8 , wherein each of the one or more slots comprises an electromagnetic bandgap (EBG) structure.
10. The apparatus of claim. 8 , wherein each of the one or more slots comprises an air gap.
11. An apparatus, comprising
a host module; and
an array transmit and receive module;
wherein the array transmit and receive module includes;
one or more first substrate layers having a first plurality of array elements;
one or more second substrate layers having a second plurality of array elements;
a third substrate layer; and
an integrated circuit on the third substrate layer, the integrated circuit to exchange
one or more radio frequency (RF) signals with the first and second pluralities of array elements;
wherein the first and second substrate layers are separated by approximately half wavelength (λ/2) corresponding to the one or more RF signals,
wherein the host module and the array transmit and receive module are to exchange one or more further signals, the one or more further signals corresponding to the one or more RF signals, and
wherein the array transmit and receive module further comprises a connector module to exchange the one or more further signals between the integrated circuit and the host module.
12. The apparatus of claim 11 , further comprising: a flexible cable coupled between the host module and the array transmit and receive module.
13. The apparatus of claim 11 , further comprising a printed circuit board (PCB), wherein the PCB is coupled to the host module and the array transmit and receive module.
14. The apparatus of claim 13 , wherein the PCB is to exchange the one or more further signals between the integrated circuit and the host module.
15. The apparatus of claim 11 , wherein the one or more RE signals are each millimeter-wave signals.
16. The apparatus of claim 11 , wherein the third substrate layer is between the one or more first substrate layers and the one or more second substrate layers.