Polishing pad for endpoint detection and related methods
A polishing pad has a polishing layer with a polishing surface and a back surface. A plurality of grooves are formed on the polishing surface, and an indentation is formed in the back surface of the polishing layer. A region on the polishing surface corresponding to the indentation in the back surface is free of grooves or has shallower grooves.
1. A polishing pad, comprising:
a polishing piece having a polishing surface and a back surface, the polishing piece surrounding an insert having a bottom surface and a recess in the bottom surface; and
a plurality of grooves formed in the polishing surface of the polishing piece;
wherein the insert is opaque to visible light and lacks grooves, and wherein the polishing piece and the insert consist of the same material, and wherein the insert has a top surface that is substantially fixed relative to the polishing surface.
2. The polishing pad of claim 1 , wherein the top surface of the insert is substantially flat.
3. The polishing pad of claim 1 , wherein the insert is physically discrete from the polishing piece and the insert is secured to a backing layer.
4. The polishing pad of claim 3 , wherein the polishing piece includes an aperture formed therein, and the insert is secured in the aperture.
5. The polishing pad of claim 4 , wherein the insert has a top section with a first cross-sectional dimension and a bottom section with a second, different cross-sectional dimension.
6. The polishing pad of claim 5 , wherein the first cross-sectional dimension is less than the second, different cross-sectional dimension.
7. The polishing pad of claim 1 further comprising a backing layer, wherein the backing layer is softer than the polishing piece.
8. The polishing pad of claim 1 further comprising a backing layer, wherein the backing layer has a first aperture therethrough and the first aperture is aligned with at least part of the insert.
9. The polishing pad of claim 8 , wherein the plurality of grooves is formed in the polishing piece and the insert is physically discrete from the polishing piece.
10. The polishing pad of claim 9 , wherein the polishing piece has a second aperture formed therein, and the insert is secured in the second aperture.
11. The polishing pad of claim 10 , wherein the first aperture has a first cross-sectional dimension and the second aperture has a second, different cross-sectional dimension.
12. The polishing pad of claim 11 , wherein the first cross-sectional dimension is less than the second cross-sectional dimension.
13. The polishing pad of claim 1 further comprising a backing layer, wherein the backing layer is a thin non-compressible layer.
14. The polishing pad of claim 1 , wherein at least part of the polishing surface of the polishing piece is co-planar with at least part of the polishing surface of the insert.
15. The polishing pad of claim 1 , wherein the plurality of grooves forms a pattern and the pattern is interrupted by the insert.
16. The polishing pad of claim 1 , wherein a first groove of the plurality of grooves forms a concentric circle and a second groove of the plurality of grooves forms an incomplete concentric circle that is incomplete where the second groove meets the insert.
17. The polishing pad of claim 1 , wherein adjacent grooves of the plurality of grooves have a spacing therebetween and the insert has a dimension greater than the spacing.
18. The polishing pad of claim 1 , wherein the polishing piece includes fillers that provide opacity.
19. The polishing pad of claim 18 , wherein the fillers are microspheres.
20. The polishing pad of claim 1 , wherein the top surface of the insert is substantially flat that and extends from an outermost lateral edge of the insert to an opposite outermost lateral edge of the insert.
21. A polishing system, comprising:
a carrier to hold a substrate;
a polishing pad supported on a platen, the polishing pad including a polishing piece having a polishing surface and a back surface, the polishing piece surrounding an insert with a recess in a bottom surface that extends only partially through the insert, and a plurality of grooves is formed in the polishing surface of the polishing piece, wherein the insert is opaque to visible light and lacks grooves, and wherein the polishing piece and the insert consist of the same material, and wherein the insert has a top surface that is substantially fixed relative to the polishing surface; and
an eddy current monitoring system having at least one of a coil and a core extending at least partially into the recess in the insert to monitor a metal layer on the substrate held by the carrier.
22. A method of polishing, comprising:
bringing a substrate into contact with a polishing surface of a polishing piece, the polishing piece having a back surface and surrounding an insert with a recess in a bottom surface, wherein a plurality of grooves is formed in the polishing surface of the polishing piece and the insert is opaque to visible light and lacks grooves, and wherein the polishing piece and the insert consist of the same material, wherein the insert has a top surface that is substantially fixed relative to the polishing surface;
supplying a polishing liquid to the polishing surface of the polishing layer; and creating relative motion between the substrate and the polishing surface.
23. The method of claim 22 , wherein the recess only extends part way into the insert and the method further comprises monitoring a metal layer on the substrate with an eddy current monitoring system that has at least one of a coil and a core extending at least partially into the recess in the insert.