Method of assembling pressure sensor device
A method of assembling a pressure sensor device includes providing a substrate having a plurality of substrate connection pads. A pressure sensor die is attached to a first major surface of the substrate and bond pads of the pressure sensor die are electrically connected to the respective substrate connection pads. A retractable cavity pin is placed on the first major surface of the substrate such that the cavity pin covers the pressure sensor die and the electrical connections to the die. A molding compound is then dispensed onto the first major surface of the substrate such that the molding compound surrounds the pressure sensor die and the cavity pin. The cavity pin is retracted such that a cavity is formed around the pressure sensor die and a gel material is dispensed within the cavity such that the gel material fills the cavity and covers the pressure sensor die.
1. A method of assembling a pressure sensor device, comprising the steps of:
providing a substrate having a plurality of substrate connection pads;
attaching a sensor die to a first major surface of the substrate;
electrically connecting bond pads of the sensor die to the respective substrate connection pads;
placing a retractable cavity pin on the first major surface of the substrate such that the cavity pin covers the sensor die and the electrical connections thereto;
dispensing a molding compound onto the first major surface of the substrate such that the molding compound surrounds the sensor die and the cavity pin;
retracting the cavity pin, whereby a cavity around the sensor die is formed; and
dispensing a gel material within the cavity, wherein the gel material substantially fills the cavity and covers the sensor die.
2. The method of assembling a pressure sensor device of claim 1 , wherein the substrate comprises a flexible printed circuit board.
3. The method of assembling a pressure sensor device of claim 1 , wherein the sensor die comprises a piezo resistive transducer (PRT) semiconductor die.
4. The method of assembling a pressure sensor device of claim 1 , further comprising attaching one or more additional semiconductor dies to the first major surface of the substrate prior to placing the cavity pin, wherein the molding compound encapsulates the one or more additional semiconductor dies.
5. The method of assembling a pressure sensor device of claim 4 , further comprising electrically connecting the one or more additional semiconductor dies to respective substrate pads.
6. The method of forming a pressure sensor device of claim 5 , further comprising electrically connecting the one or more additional semiconductor dies to the sensor die.
7. The method of assembling a pressure sensor device of claim 4 , wherein the one or more additional semiconductor dies comprise G-cell and microcontroller (MCU) dies.
8. The method of assembling a pressure sensor device of claim 7 , further comprising attaching a lid to the substrate to cover the sensor die.
9. The method of assembling a pressure sensor device of claim 1 , wherein the bond pads of the sensor die are electrically connected to the substrate pads with wires using a wire bonding process.
10. The method of assembling a pressure sensor package of claim 1 , further comprising curing the molding compound prior to retracting the cavity pin.
11. A method of assembling a pressure sensor device, comprising the steps of:
providing a substrate having a plurality of substrate connection pads;
attaching one or more semiconductor dies to a first major surface of the substrate;
electrically connecting bond pads of the one or more semiconductor dies to respective substrate connection pads of the substrate;
placing a retractable cavity pin on the first major surface of the substrate;
dispensing a molding compound onto the first major surface of the substrate such that the molding compound surrounds the one or more semiconductor dies and the cavity pin;
retracting the cavity pin, whereby a cavity is formed; and
attaching a pressure sensor die to a die-attach area within the cavity and electrically connecting bond pads of the pressure sensor die to the respective substrate connection pads; and
dispensing a gel material within the cavity such that the gel material substantially fills the cavity and covers the pressure sensor die.
12. The method of assembling a pressure sensor device of claim 11 , wherein the substrate comprises a flexible printed circuit board.
13. The method of assembling a pressure sensor device of claim 11 , wherein the pressure sensor die comprises a piezo resistive transducer (PRT) semiconductor die.
14. The method of assembling a pressure sensor device of claim 11 , wherein the one or more semiconductor dies comprise G-cell and microcontroller (MCU) dies.
15. A method of assembling a pressure sensor device, comprising the steps of:
providing a substrate having a plurality of electrical connection pads on a first major surface of the substrate;
attaching a pressure sensor die and one or more additional semiconductor dies to the first major surface of the substrate with a die attach adhesive;
electrically connecting bond pads of each of the pressure sensor die and the one or more additional semiconductor dies to the substrate connection pads with bond wires;
placing a retractable cavity pin over the pressure sensor die and the electrical connections thereto;
dispensing a molding compound onto the first major surface of the substrate, wherein the molding compound covers the one or more additional semiconductor dies and the electrical connections thereto;
retracting the cavity pin, whereby a cavity is formed around the pressure sensor die; and
dispensing a gel material within the cavity such that the gel material substantially fills the cavity and covers the pressure sensor die.
16. The method of assembling a pressure sensor device of claim 15 , further comprising attaching a lid to the substrate with a lid attach adhesive, wherein the lid covers the pressure sensor die and the gel material.
17. The method of assembling a pressure sensor device of claim 16 , further comprising electrically connecting the pressure sensor die to the one or more additional semiconductor dies with additional bond wires before placing the retractable cavity pin over the pressure sensor die.