IP Library Granted Patent US 8,549,715
Granted Patent B2
US 8,549,715 · App. 12/428,502 · Granted Oct 8, 2013

Piezoelectric microspeaker and method of fabricating the same

Inventors: Dong-kyun Kim (Suwon-si, KR); Seok-whan Chung (Suwon-si, KR); Byung-gil Jeong (Anyang-si, KR)
Assignee: Samsung Electronics Co., Ltd.
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Quick Facts
Patent No.
US 8,549,715
App. No.
12/428,502
Granted
Oct 8, 2013
Kind
B2
Abstract

A piezoelectric microspeaker fabricated by a method including: forming a lower drive unit by forming a first drive electrode by depositing and etching a first thin conductive layer on a substrate, forming a first piezoelectric plate by depositing and etching a first piezoelectric layer on the first drive electrode, and forming a first common electrode by depositing and etching a second conductive layer on the first piezoelectric plate; after forming the lower drive unit, forming a diaphragm by depositing a non-conductive layer on the first common electrode; and forming an upper drive unit by forming a second common electrode by depositing and etching a third conductive layer on the diaphragm, forming a second piezoelectric plate by depositing and etching a second piezoelectric layer on the second common electrode, and forming a second drive electrode by depositing and etching a fourth conductive layer on the second piezoelectric plate.

Claims (24)

1. A piezoelectric microspeaker fabricated according to a method comprising:

forming a lower drive unit by:

forming a first drive electrode by depositing a first thin conductive layer on a substrate and etching the first conductive layer,

forming a first piezoelectric plate by depositing a first piezoelectric layer on the first drive electrode and etching the first piezoelectric layer, and

forming a first common electrode by depositing a second conductive layer on the first piezoelectric plate and etching the second conductive layer;

after the forming the lower drive unit, forming a diaphragm by depositing a non-conductive layer on the first common electrode; and

forming an upper drive unit by:

forming a second common electrode by depositing a third conductive layer on the diaphragm and etching the third conductive layer,

forming a second piezoelectric plate by depositing a second piezoelectric layer on the second common electrode and etching the second piezoelectric layer, and

forming a second drive electrode by depositing a fourth conductive layer on the second piezoelectric plate and etching the fourth conductive layer.

2. A piezoelectric microspeaker fabricated according to a method comprising:

forming a lower drive unit by depositing a first conductive layer on a substrate, etching the first conductive layer, depositing a first piezoelectric layer on the first conductive layer, and etching the first piezoelectric layer;

after the forming the lower drive unit, forming a diaphragm by depositing a second conductive layer on the lower drive unit and etching the second conductive layer; and

forming an upper drive unit by depositing a second piezoelectric layer on the diaphragm, etching the second piezoelectric layer, depositing a third conductive layer on the second piezoelectric layer, and etching the third conductive layer.

3. The piezoelectric microspeaker of claim 1 , wherein the non-conductive layer comprises a polymer.

4. The piezoelectric microspeaker of claim 1 , wherein a central region of the diaphragm protrudes in accordance with a shape of the lower drive unit, and wherein an edge region of the diaphragm and the lower drive unit are substantially co-planar.

5. The piezoelectric microspeaker of claim 1 , wherein the method further comprises:

prior to the forming the lower drive unit, etching a part of the substrate to form a cavity, wherein the lower drive unit is formed substantially within the cavity.

6. The piezoelectric microspeaker of claim 5 , wherein the diaphragm is substantially planar.

7. The piezoelectric microspeaker of claim 2 , wherein a central region of the diaphragm protrudes in accordance with a shape of the lower drive unit, and

wherein an edge region of the diaphragm and the lower drive unit are substantially co-planar.

8. The piezoelectric microspeaker of claim 2 , wherein the method further comprises:

prior to the forming the lower drive unit, etching a part of the substrate to form a cavity, wherein the lower drive unit is formed substantially within the cavity.

9. The piezoelectric microspeaker of claim 2 , wherein the diaphragm is substantially planar.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 23, 2009
From: KIM, DONG-KYUN; CHUNG, SEOK-WHAN; JEONG, BYUNG-GIL
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 022585/0220 →
Priority Claims (1)
KR 10-2008-0092844 · Sep 22, 2008 · national
Continuity (1)
Related Publication 20100072860A1 · Mar 25, 2010