IP Library › Granted Patent US 8,553,921
Granted Patent B2
US 8,553,921 · App. 12/918,360 · Granted Oct 8, 2013

Miniature microphone, protection frame thereof and method for manufacturing the same

Inventors: Rongguo Yao (WeiFang, CN); Zhongyuan Liu (WeiFang, CN); Xianbin Wang (WeiFang, CN); Maoqiang Dang (WeiFang, CN); Shaoyang Yao (WeiFang, CN)
Assignee: GoerTek Inc.
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,553,921
App. No.
12/918,360
Granted
Oct 8, 2013
Kind
B2
Abstract

A miniature microphone is provided. In one embodiment, the miniature microphone comprises: a circuit board substrate at the upper part of the miniature microphone, wherein a plurality of contact pads are configured at prescribed positions on one side of the circuit board substrate and one or more electrical components are installed on the other side thereof; a protection frame with a cavity in the central portion thereoftherein, wherein one or more components are installed inside the cavity, the outer side of the protection frame forms the body portion, a first metal shielding layer is provided on the inner surface of the body portion, and an insulating mechanism is provided on the inner side of the first metal shielding layer, which enables the one or more components to be electrically insulated from the first metal shielding layer; and a bottom plate, wherein one or more sound holes are provided in the central portion thereoftherein for passing sound, and a second metal shielding layer is provided on the whole surface of the side of the bottom plate coming into contact with the protection frame.

Claims (16)

1. A miniature microphone, comprising:

a circuit board substrate at the upper part of the miniature microphone, wherein a plurality of contact pads are configured at prescribed positions on one side of the circuit board substrate and electrical elements are installed at prescribed positions on the other side thereof;

a protection frame with a cavity in the central portion thereof and being in the form of a cylinder with both ends opened, wherein one or more components can be installed inside the cavity, the outer side of the protection frame forms a body portion, a first metal shielding layer is provided on the inner surface of the body portion, and an insulating mechanism is provided on the inner side of the first metal shielding layer, which enables the one or more components to be electrically insulated from the first metal shielding layer; and

a bottom plate, being in the form of an plain plate, wherein one or more sound holes are provided in the central portion thereof for passing sound, and a second metal shielding layer is provided on the whole surface of the side of the bottom plate coming into contact with the protection frame.

2. A miniature microphone according to claim 1 , wherein

the insulating mechanism is an insulating layer made of resin materials or solder resists and formed on the whole inner surface of the first metal shielding layer.

3. A miniature microphone according to claim 1 , wherein

the insulating mechanism comprises one or more protruding portions integrally provided in the central portions of the four inner walls of the body portion, said protruding portions protruding towards the cavity and extending along the height direction of the protection frame.

4. A miniature microphone according to claim 1 , wherein

the insulating mechanism comprises one or more arc-like protruding portions provided in the corners of the cavity, said protruding portions protruding towards the cavity and extending along the height direction of the protection frame.

5. A miniature microphone according to claim 4 , further comprising

one or more ground portions in the body portion between the corners of the protection frame and the corresponding protruding portions, said ground portions being configured along the height direction of the protection frame and run through the protection frame.

6. A miniature microphone according to any of claim 1 to claim 5 , further comprising

one or more extended portions made of metal materials, said extended portions being circumferentially provided on the upper and the lower end faces of the protection frame, and covering at least a part of the body portion of the protection frame.

7. A protection frame for a miniature microphone comprising a cavity in the central portion the protection frame and being in the form of a cylinder with both ends opened, wherein one or more components are installed inside the cavity; the outer side of the protection frame forms a body portion, a first metal shielding layer is provided on the inner surface of the body portion, and an insulating mechanism is provided on the inner side of the first metal shielding layer, which enables the one or more components to be electrically insulated from the first metal shielding layer; wherein the insulating mechanism is an insulating layer made of resin materials or solder resists and formed on the whole inner surface of the first metal shielding layer.

8. A protection frame for a miniature microphone comprising a cavity in the central portion the protection frame and being in the form of a cylinder with both ends opened, wherein one or more components are installed inside the cavity; the outer side of the protection frame forms a body portion, a first metal shielding layer is provided on the inner surface of the body portion, and an insulating mechanism is provided on the inner side of the first metal shielding layer, which enables the one or more components to be electrically insulated from the first metal shielding layer; wherein the insulating mechanism comprises one or more arc-like protruding portions provided in the corners of the cavity, said protruding portions protruding towards the cavity and extending along the height direction of the protection frame; said protection frame further comprising one or more ground portions in the body portion between the corners of the protection frame and the corresponding protruding portions, said ground portions being configured along the height direction of the protection frame and run through the protection frame.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 15, 2020
From: GOERTEK INC.
To: GOERTEK MICROELECTRONICS CO., LTD
Reel/Frame 052937/0044 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 22, 2017
From: YAO, RONGGUO; LIU, ZHONGYUAN; WANG, XIANBIN; DANG, MAOQIANG; YAO, SHAOYANG
To: GOERTEK INC.
Reel/Frame 042458/0239 →
Priority Claims (2)
CN 2008 2 0025960 U · Jul 18, 2008 · national
CN 2008 1 0139099 · Aug 27, 2008 · national
Continuity (1)
Related Publication 20110026752A1 · Feb 3, 2011