Semiconductor photodetector structure and the fabrication method thereof
A semiconductor photodetector structure is provided. The structure includes a substrate, a photodetecting element and a semiconductor layer disposed on the photodetecting element. The substrate includes a first semiconductor material and includes a deep trench. The surface of the deep trench includes a first type dopant. The photodetecting element is disposed in the deep trench. The photodetecting element includes a second semiconductor material. The semiconductor layer includes a second type dopant.
1. A semiconductor photodetector structure, comprising:
a substrate, comprising a first semiconductor material and comprising a deep trench, wherein the surface of the deep trench comprises a first type dopant region which comprises a first type dopant, and the first type dopant region is disposed on a bottom surface of the deep trench wherein an area of the first type dopant region is smaller than the bottom surface of the deep trench;
a photodetecting element disposed in the deep trench, wherein the photodetecting element comprises a second semiconductor material, and a bottom area of the photodetecting element is smaller than the area of the first type dopant region, and the bottom area of the photodetecting element is substantially parallel to the bottom surface of the deep trench; and
a semiconductor layer disposed on the photodetecting element, wherein the semiconductor layer comprises a second type dopant.
2. The semiconductor photodetector structure in claim 1 , wherein the top surface of the photodetecting element is higher than the surface of the substrate.
3. The semiconductor photodetector structure in claim 1 , wherein the deep trench comprises a sloped sidewall.
4. The semiconductor photodetector structure in claim 1 , wherein the second semiconductor material comprises germanium.
5. The semiconductor photodetector structure in claim 1 , wherein the photodetecting element is partially filled in the deep trench.
6. The semiconductor photodetector structure in claim 1 , wherein the shape of the photodetecting element comprises a cylinder or a prism.
7. The semiconductor photodetector structure in claim 1 , wherein the semiconductor layer comprises single crystal silicon, amorphous silicon or poly silicon.
8. The semiconductor photodetector structure in claim 1 , further comprising a waveguide structure disposed on the photodetecting element, wherein the waveguide structure comprises an opening, a micro lens, a metal layer or a dielectric layer.
9. A semiconductor photodetector structure, comprising:
a substrate, comprising a first semiconductor material and comprising a deep trench, wherein the surface of the deep trench comprises a first type dopant and the deep trench comprises a sloped sidewall;
an dielectric layer in the deep trench;
a second trench disposed in the dielectric layer, wherein a sidewall of the second trench has substantially the same slope as that of the deep trench; and
a photodetecting element disposed in the second trench, wherein the photodetecting element comprises a second semiconductor material, wherein the photodetecting element shrinks from a top surface to a bottom surface.
10. The semiconductor photodetector structure in claim 9 , further comprising a semiconductor layer disposed on the photodetecting element, wherein the semiconductor layer comprises a second type dopant.
11. The semiconductor photodetector structure in claim 10 , wherein the semiconductor layer comprises single crystal silicon, amorphous silicon or poly silicon.
12. The semiconductor photodetector structure in claim 9 , wherein the surface of the photodetecting element comprises a second type dopant.
13. The semiconductor photodetector structure in claim 9 , further comprising a mono- or multi-dielectric layer disposed between the photodetecting element and the deep trench.
14. The semiconductor photodetector structure in claim 9 , further comprising a waveguide structure disposed on the photodetecting element, wherein the waveguide structure comprises an opening, a micro lens, a metal layer or a dielectric layer.