Slicing method and wire saw apparatus
The invention is directed to a method for slicing an ingot in the form of a wafer by winding a wire around a plurality of grooved rollers and pressing the wire against the ingot while making the wire travel and supplying slicing slurry to the grooved rollers, in which when the ingot is sliced, an amount of displacement of the ingot changing in an axial direction is measured and an amount of axial displacement of the grooved rollers is controlled so as to correspond to the measured amount of axial displacement of the ingot, and thereby, the ingot is sliced while controlling a relative position of the wire relative to an entire length of the ingot changing in the axial direction. As a result, a slicing method and a wire saw apparatus are provided that can perform slicing in such a way that a Bow or a Warp in a wafer obtained by slicing can be reduced, for example, by controlling a slicing path built into an ingot so that, in particular, the slicing path becomes flattened.
1. A method for slicing an ingot in a form of a wafer, the method comprising:
providing a plurality of grooved rollers, each grooved roller having a hollow shaft extending into the roller;
winding a wire around the plurality of grooved rollers and pressing the wire against the ingot while making the wire travel; and
supplying slurry to the grooved rollers;
slicing the ingot;
wherein during said slicing, measuring an amount of displacement of the ingot changing in an axial direction;
generating a profile of the amount of axial displacement of the ingot relative to a depth of slicing, wherein the profile is generated from the measured amount of axial displacement of the ingot, and, based on the profile thus generated, controlling an amount of axial displacement of the grooved rollers by passing cooling water through the hollow shafts of the grooved rollers and adjusting a temperature and/or flow rate of the cooling water, the cooling water extending into the hollow shafts at least to the extent of all the grooves, and thereby
slicing the ingot while controlling a relative position of the wire relative to an entire length of the ingot changing in the axial direction.
2. The slicing method according to claim 1 , wherein
the measurement of the amount of axial displacement of the ingot is performed by using a thermocouple or a differential displacement gage.
3. A wire saw apparatus comprising a plurality of grooved rollers, each grooved roller having a hollow shaft extending into the roller; a wire wound around the plurality of grooved rollers for slicing an ingot in a form of a wafer by pressing the wire against the ingot while making the wire travel and supplying slurry to the grooved rollers, the wire saw apparatus further comprising:
an ingot displacement measuring mechanism for measuring an amount of axial displacement of the ingot being sliced; and
a grooved roller displacement control mechanism for controlling an amount of axial displacement of the grooved rollers, based on a profile of the amount of axial displacement of the ingot relative to a depth of cut generated from the amount of axial displacement of the ingot measured by the ingot displacement measuring mechanism, whereby the amount of axial displacement of the rollers is controlled by adjusting a temperature and/or a flow rate of cooling water that is passed through the hollow shafts of the grooved rollers, the cooling water extending into the hollow shafts at least to the extent of all the grooves.