Wafer support member, method for manufacturing the same and wafer polishing unit comprising the same
Disclosed is a wafer support member including a base substrate, a support adhered at a predetermined width to the edge of the base substrate, the support having a round outermost part, and a coating layer provided on the outermost edge of the support.
1. A wafer support member, comprising:
a base substrate;
a support including at least two layers, the support being adhered at a predetermined width to the edge of the base substrate, the support having a round outermost part, the round outermost part extending between a top surface and a lateral side surface of the support such that an edge formed between the top and lateral side surface of the support is rounded; and
a coating layer provided on a first portion of the support such that a second portion of the support is exposed, wherein the first portion of the support includes the round outermost part of the support, and wherein a curvature of the at least two layers at the round outermost part of the support is the same.
2. The wafer support member according to claim 1 , wherein the coating layer is an epoxy coating layer.
3. The wafer support member according to claim 1 , wherein the coating layer is composed of a mixture of epoxy and a polymer at a weight ratio of 2:1 to 4:1.
4. The wafer support member according to claim 1 , wherein the coating layer is provided to a thickness of 0.2 to 0.5 mm on the outermost edge of the round support.
5. The wafer support member according to claim 1 , wherein the coating layer is wider than the round part of the support.
6. The wafer support member according to claim 1 , wherein a ratio of the width of the coating layer to the width of the round part of the support is 1.4:1 to 1.6:1.
7. The wafer support member according to claim 6 , wherein the coating layer is further provided to a thickness of 0.1 to 0.3 mm in the non-round part of the support.
8. A wafer polishing unit, comprising:
a wafer support member to support a wafer;
a pressurizing unit to apply pressure to the wafer support member; and
a pressure-supplying unit to supply pressure to the pressurizing unit,
wherein the wafer support member includes a base substrate, a support adhered at a predetermined width to the edge of the base substrate, the support having a round outermost part and the support including at least two layers, the round outermost part extending between a top surface and a lateral side surface of the support such that an edge formed between the top and lateral side surface of the support is rounded, and a coating layer provided on a first portion of the support such that a second portion of the support is exposed, the first portion including the round outermost part of the support, wherein a curvature of the at least two layers at the round outermost part of the support is the same.
9. The wafer polishing unit according to claim 8 , wherein the coating layer is an epoxy coating layer.
10. The wafer polishing unit according to claim 8 , wherein the coating layer is composed of a mixture of epoxy and a polymer at a weight ratio of 2:1 to 4:1.
11. The wafer polishing unit according to claim 8 , wherein the support is provided to a thickness of 0.2 to 0.5 mm on the outermost edge of the round support.
12. The wafer polishing unit according to claim 8 , wherein the coating layer is wider than the round part of the support.
13. The wafer polishing unit according to claim 8 , wherein a ratio of the width of the coating layer to the width of the round part of the support is 1:1.4 to 1:1.6.
14. The wafer polishing unit according to claim 13 , wherein the coating layer is further provided to a thickness of 0.1 to 0.3 mm in the non-round part of the support.